Senior OSAT Packaging & NPI Engineering Lead

QORVO INTERNATIONAL PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore seeks an experienced engineering manager to oversee product and project development. The role requires proficiency in English and Chinese for collaboration with customers and suppliers in China and Taiwan. Ideal candidates have over 10 years of experience in semiconductor packaging and assembly. Responsibilities include managing projects, driving innovation, and leading cross-functional teams. This position promises a dynamic and collaborative environment, aiming for continuous improvement.

Qualifications

• Minimum 10 years in semiconductor packaging or assembly engineering industry.
• Ability to address internal and external customer complaints.
• Proven experience with multitasking in a fast-paced environment.

Responsibilities

• Manage Qorvo products for smooth ATI/NPI execution and HVM engineering.
• Lead and manage OSAT New Technology and New Product Introduction.
• Implement continuous process improvement and innovative value engineering projects.

Skills

Good communication skills

Problem-solving skills

Interpersonal skills

Ability to drive supplier performance

Education

Bachelor’s or master’s degree in mechanical engineering or related field

Job description

A leading semiconductor company in Singapore seeks an experienced engineering manager to oversee product and project development. The role requires proficiency in English and Chinese for collaboration with customers and suppliers in China and Taiwan. Ideal candidates have over 10 years of experience in semiconductor packaging and assembly. Responsibilities include managing projects, driving innovation, and leading cross-functional teams. This position promises a dynamic and collaborative environment, aiming for continuous improvement.