R&D Scientist – Co-Packaged Optics (NSTIC), IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading research organization in Singapore is seeking an experienced engineer or physicist to develop advanced optical interconnects for Co-Packaged Optics. The ideal candidate will possess a Ph.D. or MS degree and have a strong background in optical interconnect modeling. Responsibilities include designing lenses for optical I/Os, evaluating fiber array assemblies, and proposing innovative ideas to enhance optical interconnects. Strong communication and teamwork skills are essential. Competitive compensation is offered.

Qualifications

• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling.
• Knowledge in wafer-level processes such as lithography and plasma etching.

Responsibilities

• Develop optical interconnects for Co-Packaged Optics platforms.
• Simulate impacts on optical signal transmission.
• Design lenses for optical I/Os in wafer-scale integration.

Skills

Optical interconnect modeling

Microscope-based alignment

Strong communication skills

Teamwork

Technical reporting

Education

MS or Ph.D in Engineering or Physics

Tools

Optical testing and metrology tools

Wafer bonding

Dicing

Job description

Roles & Responsibilities

Job Description :

• Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative-material lenses for optical I / Os in wafer-scale integration.
• Estimate optical losses between grating / edge couplers and fiber interfaces via lens structures.
• Design package level / wafer-level optical interconnects between GPU–GPU and GPU–memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to improve the state of the art in optical interconnects and testing.

Job Requirements

• MS or Ph.D in Engineering or Physics.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
• Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
• Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
• Proficiency with microscope-based alignment, metrology, and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.