R&D Scientist, Co-Packaged Optics (NSTIC), IME

A •STAR; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A leading research organization in Singapore seeks an experienced professional for the development of advanced optical interconnects in Co-Packaged Optics platforms. Candidates must have a Ph.D. in Engineering or Physics, and a strong background in optical interconnect modeling. Responsibilities include designing lens structures, simulating signal transmission impacts, and evaluating fiber array assemblies. Strong communication and teamwork skills are necessary. This position offers the opportunity to innovate in optical interconnects and test environments.

Qualifications

• Ph.D in Engineering or Physics required.
• Strong background in optical interconnect modeling essential.
• Understanding of passive alignment techniques for fiber-to-chip coupling needed.
• Familiarity with photonic packaging platforms and coupling interfaces important.

Responsibilities

• Develop optical interconnects for advanced Co-Packaged Optics platforms.
• Simulate impacts on optical signal transmission.
• Design lenses for optical I/Os in wafer-scale integration.
• Evaluate fiber array assemblies with CPO test vehicles.

Skills

Optical interconnect modeling

Communication skills

Teamwork

Education

Ph.D in Engineering or Physics

Tools

Microscope-based alignment

Metrology tools

Job description

Job Description :

• Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative-material lenses for optical I / Os in wafer-scale integration.
• Estimate optical losses between grating / edge couplers and fiber interfaces via lens structures.
• Design package level / wafer-level optical interconnects between GPU-GPU and GPU-memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to improve the state of the art in optical interconnects and testing.

Job Requirements :

• Ph.D in Engineering or Physics.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
• Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
• Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
• Proficiency with microscope-based alignment, metrology, and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.