Principal Scientist (HI), IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 125,000 - 150,000; Full time

Job summary

A leading research organization in Singapore is looking for a Scientist or Senior Scientist to advance semiconductor packaging technologies. The role involves leading projects on chip-to-wafer bonding techniques and collaborating with industry partners on innovative solutions. Candidates should have a PhD in a relevant field and 5 to 10 years of experience in device fabrication and advanced packaging. Strong problem-solving and project management skills are essential for success in this position.

Qualifications

• 5 to 10 years of experience in device fabrication and advanced packaging processes.
• Hands-on experience in BEOL wiring processes and hybrid bonding.
• Demonstrated ability to manage multiple tasks and projects.

Responsibilities

• Lead development of new materials and advanced process integration.
• Manage internal and external stakeholders for R&D projects.
• Conduct engineering experiments for process characterization.

Skills

Advanced packaging technologies

Data analysis

Problem-solving

Project management

Communication skills

Collaboration

Education

PhD in Materials Science

PhD in Engineering

Job description

JOB DESCRIPTION

The Advanced Packaging Programme at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team at the forefront of semiconductor innovation. In this role, you will drive state-of-the-art chip-to-wafer and wafer-to-wafer fusion/hybrid bonding technologies, develop 2.5D interposer and 3D chip-stacking process integration flows, and enable heterogeneous integration of chiplets for next-generation Artificial Intelligence and High-Performance Computing applications. You will also lead electrical, thermal, and mechanical reliability characterization, contributing directly to technologies with real-world impact. This position offers an exciting opportunity to collaborate with a dynamic team of researchers and external industry partners while shaping the future of advanced packaging.

Key Responsibilities

• Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts.
• Lead multi-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues.
• Engage and manage internal and external stakeholders for the R&D projects execution and provide timely updates for timely deliverable.
• Conduct research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimize die-bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, bonding materials and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Collaborate with senior staff, process integrators, and external partners to address technology roadmap and process capabilities development.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

JOB REQUIREMENT/Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• 5 to 10 years of experience in device fabrication, back-end-of-line (BEOL) and advanced packaging processes & integration required for 2.5D/3D heterogeneous integration applications. Project and stakeholder (including industry partners) management experience will be added advantage. Hands-on experience in BEOL wiring processes & integration, C2W/W2W fusion/hybrid bonding and flip-chip bonding are required.
• Strong knowledge in advanced packaging technologies in particular hybrid bonding equipment, bonding materials, processes & integration, andreliability characterization are preferable.
• Strong analytical and problem-solving skills, with proficiency in data analysis, interpretation, and design of experiments. Demonstrated ability to troubleshoot and resolve process-related challenges. Excellent written and verbal communication skills.
• Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.