Laser Bonding Process Engineer - Advanced Packaging

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading HR advisory firm in Singapore is seeking a Laser-Assisted Bonder (LAB) Process Engineer. You will be responsible for developing and optimizing laser bonding processes, particularly in advanced packaging applications. The ideal candidate has a degree in engineering and at least 2-5 years of experience in semiconductor packaging. This position offers a competitive salary range of $6000 - $8000, depending on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Familiarity with laser or optical systems is necessary.
• Excellent troubleshooting and risk analysis skills.

Responsibilities

• Develop and optimize laser-assisted bonding processes.
• Qualify new laser bonding processes from R&D to production.
• Troubleshoot laser systems to resolve yield and quality issues.

Skills

Laser Assisted bonding technologies

Troubleshooting

Risk analysis

Statistical analysis (JMP, Minitab)

Advanced process control

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Tools

X-ray

SAM

OM

Job description

A leading HR advisory firm in Singapore is seeking a Laser-Assisted Bonder (LAB) Process Engineer. You will be responsible for developing and optimizing laser bonding processes, particularly in advanced packaging applications. The ideal candidate has a degree in engineering and at least 2-5 years of experience in semiconductor packaging. This position offers a competitive salary range of $6000 - $8000, depending on experience.