Electrochemical Plating Process Scientist

Agency for Science, Technology and Research (A*STAR); Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A leading research institution in Singapore is seeking a highly experienced Electrochemical Plating Process Scientist to enhance advanced packaging and semiconductor process development. The ideal candidate should possess a PhD in related fields and at least 3 years of experience in ECP processes, with strong analytical skills in JMP and Excel. Responsibilities include leading process optimization, managing equipment procurement, and collaborating with various teams to improve yield and efficiency.

Qualifications

• Minimum of 3 years of experience in ECP processes.
• Strong understanding of metal to metal bonding.
• Advancement in analytical skills using JMP and defect analysis.

Responsibilities

• Lead development and optimization of ECP processes for advanced packaging applications.
• Drive process control and SPC for BEOL PVD and ECP processes.
• Manage equipment procurement and qualification for plating chemicals.
• Collaborate cross-functionally with QA and integration teams.

Skills

Metal to metal bonding

Analytical skills

Process control

Education

PhD Degree in Physics, Materials Science, Chemistry or related field

Tools

JMP

Excel

Defect analysis platforms

Job description

About the Role:

We are seeking a highly experienced and driven Electrochemical Plating Process Scientist to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.

Key Responsibilities:

• Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
• Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
• Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
• Support integration and yield improvement for SVP builds such as WLP, FOWLP, and C2W.
• Conduct DOE and troubleshooting for process enhancement and defect reduction.
• Collaborate cross-functionally with QA, integration, and equipment teams to ensure robust process performance.
• Champion continuous improvement initiatives including cost reduction, productivity enhancement, and system optimization.

Qualifications:

• PhD Degree in Physics, Materials Science, Chemistry or related field.
• Strong understanding of metal to metal bonding with minimum of 3 years of experience in ECP processes
• Strong analytical skills with tools like JMP, Excel, and defect analysis platforms.