Die Bonding Applications Engineer – Advanced Packaging

CAPCON SINGAPORE PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor manufacturing company in Singapore seeks an experienced Application/Process Engineer to join their Advanced Control & Test team. This role focuses on the design and optimization of advanced die bonding applications. The successful candidate will analyze customer needs, troubleshoot issues, and enhance process capabilities. The ideal applicant should have at least 3 years of relevant experience and a strong background in advanced packaging technologies. Competitive compensation and growth opportunities are provided.

Qualifications

• 3+ years of experience in semiconductor packaging, die bonding equipment, or electronics manufacturing.
• Strong knowledge of advanced packaging technologies like Flip-Chip and PoP.
• Hands-on troubleshooting skills in high-tech manufacturing environments.

Responsibilities

• Lead design and validation of software and hardware for die bonding processes.
• Analyze requirements for customized semiconductor packaging solutions.
• Conduct troubleshooting and failure analysis for die attach tools.

Skills

Advanced packaging technologies

Troubleshooting

Process optimization

Communication

Education

Bachelor's or Master's degree in Engineering

Tools

Semiconductor packaging equipment

Job description

A leading semiconductor manufacturing company in Singapore seeks an experienced Application/Process Engineer to join their Advanced Control & Test team. This role focuses on the design and optimization of advanced die bonding applications. The successful candidate will analyze customer needs, troubleshoot issues, and enhance process capabilities. The ideal applicant should have at least 3 years of relevant experience and a strong background in advanced packaging technologies. Competitive compensation and growth opportunities are provided.