TCB Advanced Semiconductor Packaging Design Engineer - YZ11

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR Consultancy is seeking a TCB Design Engineer to design and develop innovative bonding modules. The ideal candidate holds a degree in a related field and has 2-5 years of relevant experience, along with strong knowledge in CAD systems like CREO Parametric. Responsibilities include overseeing prototype fabrication and collaborating with engineering teams to ensure robust designs. Competitive salary range from $6000 to $8000 based on experience.

Qualifications

• 2-5 years of hands-on experience in design and development in semiconductor packaging.
• Experience with TCB bonding technologies is highly preferred.
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress.

Responsibilities

• Design innovative TCB modules assemblies for bonding.
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Collaborate with manufacturing engineers for assembly of module systems.

Skills

3D/2D CAD knowledge

Excellent troubleshooting

FMEA

Statistical analysis

Education

Bachelor's or Master's degree in related field

Tools

CREO Parametric

X-ray

Job description

Overview

Position title: TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $6000 - $8000 (depends experience)

Responsibilities

• Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machine Modules.
• Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Nice-to-have (Good-to-have)

• Thermal & Mechanical Analysis: Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
• Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279