IC Package Design Engineer — Hybrid, Tempe

Amkor Technology; Strong Township; Hybrid; CAD 110,000 - 146,000; Full time

Job summary

A global leader in semiconductor solutions is seeking an IC Package Design Engineer to create high-quality designs and detailed engineering drawings. This position involves verifying design rules, collaborating with product and sales teams, and improving design technologies. Candidates should hold a Bachelor's degree in Electrical or Mechanical Engineering, have CAD experience, and strong communication skills. The role is hybrid, and residency near the office is required.

Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or relevant field required.
• Experience using CAD software for engineering drawings.
• Excellent verbal and written communication skills needed.

Responsibilities

• Design Laminate (BGA) and Wafer Level packages.
• Create detailed engineering drawings with little supervision.
• Solve design problems and improve design technology.

Skills

CAD software proficiency

Communication skills

Self-motivated

Team-oriented

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Mechanical Engineering

Tools

Cadence APD

Cadence Sigrity

Siemens Expedition

Ansys HFSS

CAM350

Job description

A global leader in semiconductor solutions is seeking an IC Package Design Engineer to create high-quality designs and detailed engineering drawings. This position involves verifying design rules, collaborating with product and sales teams, and improving design technologies. Candidates should hold a Bachelor's degree in Electrical or Mechanical Engineering, have CAD experience, and strong communication skills. The role is hybrid, and residency near the office is required.