W2W Bonding Research Scientist (APM), IME

A •STAR; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading research organization in Singapore is seeking a Research Scientist to advance wafer-to-wafer bonding processes for semiconductor applications. This role focuses on optimizing bonding techniques and materials while leading projects that drive innovation in high-performance computing and AI technologies. The ideal candidate will hold a PhD in Materials Science or a related field and have experience in advanced packaging technologies. Join a team committed to technological advancement and mentorship in the semiconductor industry.

Qualifications

• PhD in relevant field is mandatory.
• Experience in wafer-to-wafer bonding processes is preferred.
• Strong analytical skills with a track record of advancements in semiconductor technologies.

Responsibilities

• Develop innovative W2W bonding techniques for high-performance applications.
• Optimize bonding parameters for enhanced bonding strength and yield.
• Lead projects and collaborate with partners to drive technology advancements.

Skills

Advanced packaging technologies

Material selection

Data analysis

Process optimization

Education

PhD degree in Materials Science

PhD degree in Mechanical Engineering

PhD degree in Physics

PhD degree in Chemistry

PhD degree in Electronics

PhD degree in Electrical Engineering

Tools

SEM

SAM

AFM

Job description

Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.

Job Description

Research and Development

• Process Innovation : Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
• Material Science : Investigating and selecting appropriate bonding materials (e.g., low-temperature organic / inorganic materials, Cu / oxide, Cu / polymer) to ensure strong and stable interfaces.
• Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
• Problem Solving : Addressing challenges related to process integration, such as wafer warpage, thermal budget constraints, contamination, and the reduction of thermo-mechanical stress.

Characterization and Analysis

• Process Evaluation : Coordinating and executing comprehensive evaluations of new processes, materials, and equipment.
• Reliability Testing : Conducting electrical, thermal, and mechanical reliability characterization of bonded structures (e.g., using SEM, SAM, AFM) to validate performance and ensure manufacturing guidelines are met.
• Data Analysis : Utilizing metrology tools and data analysis to assess surface topography, void defects, and bond quality, and driving quality improvements based on these findings.

Collaboration and Strategy

• Project Leadership : Conceiving, planning, and leading high-impact projects, often involving external partners and stakeholders.
• Technology Road mapping: Collaborating with senior staff and process integrators to define and address future technology roadmaps and business challenges in advanced packaging.
• Intellectual Property: Generating detailed reports and contributing to the creation of new intellectual property (IPs) and knowledge areas to strengthen the company;s portfolio.
• Mentorship : Inspiring and mentoring scientists, engineers and technicians in advanced semiconductor technologies.

Job Requirements

• PhD degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in W2W bonding process, with a strong track record in advanced packaging technologies is added advantage.