TCB Design Engineer (Semiconductor Packaging| Up to $8000) - LY12

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading recruitment agency in Singapore is seeking a TCB Design Engineer to design and optimize TCB modules in semiconductor packaging. Responsibilities include design development, testing prototypes, and collaborating with engineers to enhance thermal control. Candidates should have a relevant degree and 2–5 years of experience in related fields. A competitive salary and comprehensive benefits are offered.

Qualifications

• Minimum 2–5 years of experience in design and development of equipment or semiconductor packaging.
• Knowledge in 3D/2D CAD is necessary.
• Experience with TCB or Laser Assisted bonding technologies is a plus.

Responsibilities

• Design TCB modules for Chip-to-Wafer or Chip-to-Substrate bonding.
• Oversee prototype fabrication and testing for thermal control.
• Collaborate with engineers for machine integration and improvements.

Skills

Design & Development

Prototyping & Testing

Compliance & Documentation

Thermal & Mechanical Analysis

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Tools

CREO Parametric

CREO Windchill PLM system

Job description

Overview

Position: TCB (Thermo Compression Bonding) Design Engineer. Location: Admiralty Street. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $6000 - $8000 (depends experience).

Interested applicants can also send your resume to WA: [phone] (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.

TAN LEE XIAN Reg No: R24123487

The Supreme HR Advisory Pte Ltd EA No: 14C7279

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Responsibilities

Must-have:

• Design & Development — Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding; responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA); planning, scheduling and costing of machine modules.
• Prototyping & Testing — Oversee fabrication of prototype modules and their integration with TCB platforms; analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support — Collaborate with Electrical, Vision and Software Engineers for machine integration; collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls); collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems; support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation — Document all designs, simulations, and test results according to quality management and IP standards; remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis — Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/bondstage; design and validate cooling channels inside the bondhead/bondstage to achieve rapid cooling and enhance temperature uniformity; mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

TAN LEE XIAN Reg No: R24123487

The Supreme HR Advisory Pte Ltd EA No: 14C7279