TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)

The Supreme HR Advisory; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A reputable HR firm in Singapore is seeking a TCB Design Engineer to design and optimize modules for semiconductor packaging. You will have a key role in ensuring thermal control during bonding processes. The ideal candidate will possess a relevant degree and 2–5 years of hands-on experience in equipment design and development. A competitive salary between $6000 - $8000 will be offered, depending on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in equipment design or semiconductor packaging.
• Experience with TCB or Laser Assisted bonding technologies is preferred.
• Knowledge of thermal/mechanical stress impact on materials.

Responsibilities

• Design innovative TCB modules for bonding processes.
• Oversee prototype fabrication and integration.
• Collaborate with engineers for machine integration and improvements.

Skills

3D/2D CAD knowledge

Troubleshooting skills

Risk analysis

FMEA expertise

Statistical analysis

Knowledge of bonding processes

Education

Bachelor’s or Master’s degree in Materials Science or Engineering

Tools

CREO Parametric

JMP

Minitab

Job description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Responsibilities

• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
• Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

End of description.