Senior Scientist, Advanced Packaging & 3D IC Integration

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 125,000 - 150,000; Full time

Job summary

A leading research organization in Singapore is looking for a Scientist or Senior Scientist to advance semiconductor packaging technologies. The role involves leading projects on chip-to-wafer bonding techniques and collaborating with industry partners on innovative solutions. Candidates should have a PhD in a relevant field and 5 to 10 years of experience in device fabrication and advanced packaging. Strong problem-solving and project management skills are essential for success in this position.

Qualifications

• 5 to 10 years of experience in device fabrication and advanced packaging processes.
• Hands-on experience in BEOL wiring processes and hybrid bonding.
• Demonstrated ability to manage multiple tasks and projects.

Responsibilities

• Lead development of new materials and advanced process integration.
• Manage internal and external stakeholders for R&D projects.
• Conduct engineering experiments for process characterization.

Skills

Advanced packaging technologies

Data analysis

Problem-solving

Project management

Communication skills

Collaboration

Education

PhD in Materials Science

PhD in Engineering

Job description

A leading research organization in Singapore is looking for a Scientist or Senior Scientist to advance semiconductor packaging technologies. The role involves leading projects on chip-to-wafer bonding techniques and collaborating with industry partners on innovative solutions. Candidates should have a PhD in a relevant field and 5 to 10 years of experience in device fabrication and advanced packaging. Strong problem-solving and project management skills are essential for success in this position.