Senior Process R&D Engineer

HiPA Photonics Pte. Ltd.; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

A leading technology firm in Singapore is looking for a Senior / Principal Process R&D Engineer to focus on developing micro-machining processes for brittle materials like glass and ceramics. The ideal candidate will have at least 5 years of experience and will lead a small R&D team to innovate on fiber-optic manufacturing platforms. This role offers the opportunity to work on cutting-edge technology with significant autonomy and impact within the company.

Qualifications

• 5+ years of experience in brittle material micro-machining.
• Solid understanding of mechanical and thermal behaviour of brittle materials.
• Experience in the nanoimprint lithography process.

Responsibilities

• Develop and optimise micro-structuring processes on brittle substrates.
• Define measurement methodologies for process accuracy and stability.
• Build and mentor a small focused R&D team.

Skills

Brittle material micro-machining

Nanoimprint lithography

Process window definition

Root-cause analysis

Experimental execution

Education

Master’s or PhD degree in Materials Science

Master’s or PhD degree in Mechanical Engineering

Master’s or PhD degree in Micro/Nano Fabrication

Tools

Optical and white-light interferometry

SEM

AFM

Job description

Job Description

Position Overview

We are seeking a hands‑on Senior / Principal Process R&D Engineer with strong experience in micro‑machining of brittle materials (such as glass, ceramics, or silicon) for fiber‑optic and photonics‑related applications. The role focuses on developing high‑precision, repeatable, and scalable micro‑structuring processes, leveraging technologies such as nanoimprint lithography, thermal imprint / hot embossing, laser micro‑machining and hybrid micro‑fabrication approaches. The successful candidate will help build a small process R&D team in Singapore and drive early‑stage process innovation toward future high‑density fiber‑optic manufacturing platforms.

Key Responsibilities

(1) Brittle Material Micro‑Machining Process Development

• Develop and optimise high‑precision micro‑structures on brittle substrates, including:
• Glass
• Technical ceramics
• Silicon or similar materials
• Explore and integrate processes such as:
• Nanoimprint lithography (UV‑NIL / Thermal NIL)
• Thermal imprint / hot embossing
• Hybrid flows (imprint + etch, imprint + laser, imprint + CMP, etc.)
• Establish stable process windows with strong repeatability and yield.

(2) Tooling, Mold & Material Interaction

• Define requirements for precision molds / stamps / tooling, including:
• Material selection (Si, quartz, Ni‑based, hard‑coated tools, etc.)
• Surface treatments and anti‑sticking / release layers
• Study and optimise:
• Thermo‑mechanical behaviour of brittle materials
• Stress, shrinkage, deformation, and defect mechanisms
• Identify and mitigate risks related to:
• Sticking and release
• Cracking, chipping, and residual stress
• Tool wear and lifetime

(3) Process Characterisation & Metrology

• Define measurement and qualification methodologies for:
• Dimensional accuracy and uniformity
• Profile geometry and surface quality
• Defect density and process stability
• Utilise and correlate data from:
• Optical and white‑light interferometry
• SEM / AFM / profilometry
• Custom in‑house test structures where needed

(4) Team Building & External Collaboration

• Build and mentor a small, focused process R&D team (2–5 members)
• Collaborate with:
• Equipment vendors
• Material and tooling suppliers
• External research institutes or industrial partners (as needed)
• Support technology transfer from R&D into pilot manufacturing.

Required Qualifications

Education

• Master’s or PhD degree in:
• Materials Science
• Mechanical Engineering
• Micro / Nano Fabrication
• Applied Physics
• Semiconductor / MEMS‑related disciplines

Technical Experience

• 5+ years of hands‑on experience in one or more of the following areas:
• Brittle material micro‑machining
• Nanoimprint lithography (UV or thermal)
• Thermal imprint / hot embossing
• Ultra‑fast laser processing for brittle materials
• Precision micro‑structuring processes
• Solid understanding of:
• Mechanical and thermal behaviour of glass, ceramics, or silicon
• Tool–material interactions at micro / nano scales
• Process repeatability, yield, and manufacturability

Practical Skills

• Strong experimental execution capability
• Experience with:
• Process window definition
• DOE‑based optimisation
• Root‑cause analysis for yield and defect issues
• Willingness to personally conduct experiments in early‑stage development.

Preferred / Plus Qualifications

• Experience in fiber‑optic, photonics, or opto‑electronic manufacturing
• Exposure to:
• Laser micro‑machining of brittle materials
• CMP, wet / dry etching of glass or ceramics
• Multi‑step hybrid process integration
• Experience in early‑stage technology incubation or scale‑up
• Prior work in semiconductor, MEMS, or photonics packaging ecosystems

Soft Skills & Mindset

• Strong sense of process ownership and accountability
• Comfortable working in ambiguous, exploratory environments
• Engineering‑driven mindset with practical problem‑solving ability
• Ability to communicate clearly with management and cross‑functional teams
• Motivation to build long‑term, core manufacturing know‑how

Career Path & Growth

• Potential evolution into:
• Principal Technologist – Photonics Manufacturing
• Head of Brittle Material Process Technology
• Opportunity to shape:
• Core process IP
• Future fiber‑optic manufacturing platforms and applications

Why Join Us

• Work on next‑generation fiber‑optic manufacturing challenges
• High level of technical ownership and autonomy
• Opportunity to influence process architecture from the ground up
• Strong commitment to advanced equipment, tooling, and long‑term R&D
• High‑growth publicly listed technology company (JPT, stock code: 688025)
  Serving leading global high‑growth technology customers