Packaging Engineer

Advanced Micro Devices, Inc; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a senior expert to lead the validation and characterization of advanced packaging solutions. The role involves establishing lab capabilities, analyzing data, and guiding junior engineers. The ideal candidate has over 10 years of experience in packaging and is proficient in various characterization methods. This position offers opportunities to collaborate with internal and external partners to advance technology and product roadmaps.

Benefits

Competitive benefits

Collaborative work culture

Qualifications

• 10+ years of experience in packaging and characterization.
• Experience with characterization methods including x-ray imaging and spectroscopy.
• Ability to work independently and as part of a team.

Responsibilities

• Establish packaging lab capabilities for advanced solutions.
• Lead data collection and analysis efforts.
• Drive roadmap enablement aligned to technology and product strategies.

Skills

Packaging and metrology expertise

Data collection and analysis

Statistical methods

Team collaboration

Team collaboration

Education

PhD in mechanical engineering, electrical engineering, material science, or related field

Tools

Optical/electron microscopy

Thermal-mechanical testing equipment

Thermal-mechanical testers

Statistical analysis software

Job description

WHAT YOU DO AT AMD

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

JOB SUMMARY

Lead experimental validation and characterization of advanced packaging solutions such as 2.5D / 3D, CPO, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities.

KEY RESPONSIBILITIES

• Establish Packaging Lab Capabilities: drive experimental validation and characterization of advanced packaging solutions such as 2.5D / EFB / CoWoS / WLFO, CPO, CoW / WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies.
• Lead Data Collection & Analysis efforts, collaborating with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities).
• Drive Technology & Product Roadmap Enablement: define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps.
• Cultivate Strategic Partnerships: develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources.
• Provide Technical Leadership: provide expert guidance on metrology and package characterization techniques, stay abreast of industry trends and advancements in semiconductor packaging and characterization, and mentor and guide junior engineers and technicians.

PREFERRED EXPERIENCES

• 10+ years of experience in packaging, metrology, characterization, design validation of components, packages and platforms.
• Experience with a variety of characterization methods including optical / electron microscopy, thermal‑mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moiré, x‑ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC‑MS).
• Experience with data collection and analysis, including statistical methods.
• Demonstrated ability to work independently and in a team environment.

ACADEMIC CREDENTIALS

Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent.

LOCATION

Singapore

BENEFITS & COMPENSATION

Benefits offered are described: AMD benefits at a glance.

EEO STATEMENT

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and / or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services.