Qorvo (Nasdaq : QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high‑growth segments of large global markets, including consumer electronics, smart home / IoT, automotive, EVs, battery‑powered appliances, network infrastructure, healthcare and aerospace / defense. Visit to learn how our innovative team is helping connect, protect and power our planet.
Job Description / Accountabilities
- Manage Qorvo products for smooth ATI / NPI execution and HVM engineering
- Early engagement & execution of a Packaging Technology development working with Qorvo PKG team & OSAT partner on‑site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
- Could Manage multiple projects for package development from risk assessment, process / BOM establishment, qualification.
- Utilize program management methodology to plan, execute and monitor complex process and / or product development projects.
- Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner
- Strong problem‑solving skill in Assembly engineering and leadership working with OSATs partner & cross functional team in Qorvo
- Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the R&D, Quality and Product line is necessary.
- Think and act professionally in the consistent Manner as a Qorvo engineering representative of on‑site OSAT
- Manage / Coach QI’s engineering resource from the daily work
- Able to implement Continuous process improvement and innovation Value Engineering projects
- Could manage other work centers as well upon requested
- Report to Engineering Director in Singapore Qorvo International
Requirements
- Good communication skill with open minded to learn semiconductor area : Bumping, DPS and Assembly process
- Bachelor’s or master’s degree in mechanical engineering, Material Science engineering or a related field
- Minimum 10 years in semiconductor packaging or assembly engineering industry
- Good attitude, detail‑orientated, proactive, quick learner and able to work effectively in a fast‑paced environment
- Proven strong interpersonal and communication skills with willingness to take accountability
- Ability to address internal and external customer complaints and do multi‑tasking
- Ability to lead cross‑functional teams and drive supplier performance
Language
- English fluency in addition to Chinese language working with OSATs & Customers who are chinese speaking in countries like China & Taiwan