Member of Technical Staff / Principal Product Engineer (Package PE)

Micron; Singapore; On-site; SGD 100,000 - 140,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an MTS / Principal Product Engineer. You will lead a top-performing team focused on Package and HBM Product engineering, driving innovations that enhance performance and yield. The ideal candidate has over 10 years in the semiconductor industry and strong leadership skills, along with a passion for technology and team development. Join us and contribute to world-class innovations!

Qualifications

• Over 10 years of semiconductor industry experience, preferably in Product Engineering and Advanced Packaging.
• Proficiency in statistics and data analysis tools and scripting.
• Strong track record of collaborative work within / across teams.

Responsibilities

• Lead impactful initiatives to enhance overall cumulative yield and quality improvement.
• Partner with various teams to ensure comprehensive product development.
• Cultivate project oversight abilities among the team for effective project completion.

Skills

Leadership

Problem-solving

Data analysis

Communication

Collaboration

Education

Bachelor's / Master's in Electrical / Electronic / Mechanical Engineering

Tools

Statistics and data analysis tools

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing : using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As the MTS / Principal Product Engineer (Package PE) at Micron, you will lead a top-performing team focusing on Package and HBM Product engineering within the HBM Product and System Engineering Team.

Key Responsibilities

• Cumulative Yield Ownership : Lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
• Reduce Time 0 DPM : By improving assembly-related coverage in manufacturing flows.
• Enhance HBM Cube Yield : Work together with Technology Development and Packaging teams to enhance test coverages and boost HBM Cube yield.
• Root Cause and Resolution of Qual and RMA Packaging Issues : Debug and identify root causes of failures through Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA), driving resolutions and improvements through cross-functional team collaboration.
• Support and Progress : Provide support to facilitate progress and development among team members within the team and organization.
• Cross-Functional Collaboration : Partner with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, and Quality / Reliability teams, to ensure the comprehensive development and successful shipping of end products.
• Promotion of Innovation : Foster innovation and inspire changes that offer a technical advantage over competitors, preserving Micron's competitive edge in the market.
• Project Management : Cultivate project oversight abilities among the team to guarantee effective project completion, resulting in the punctual delivery of tech solutions.
• Technical Decision Making : Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.
• AI / ML Advocate : Build and assess AI / ML models to boost important metrics including Quality, Cost, Cycle Time, and Scale.

Additional Responsibilities

• Subject Matter Expert : Serve as the go-to expert in your domain, providing guidance and insights to support decision-making and strategy development.
• Leading Complex Projects : Define and drive critical multi-disciplinary projects to ensure successful execution and completion.
• Organization Spokesperson and Expert : Act as the main contact and expert, providing detailed analysis on project and technical issues.
• Nurturing Potential Leaders : Guide and support team members to cultivate the development of upcoming technical leaders within the organization.
• Innovation and Improvement : Continuously seek and implement innovative solutions to improve processes and technologies.

Requirements

• Bachelor's / Master's in Electrical / Electronic / Mechanical Engineering with over 10 years of semiconductor industry experience, preferably in Product Engineering and Advanced Packaging.
• Strong leadership and technical skills, especially in problem-solving with root cause understanding and solution space through in-depth circuit analysis.
• Proficiency in statistics and data analysis tools and scripting.
• Highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment.
• Proven track record of collaborative work within / across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability towards assigned roles with professional work ethics.
• Excellent communication, collaboration, and presentation skills.
• Passionate about people and technical leadership, with a drive toward ongoing learning and development in this area.

Join us at Micron and be part of an exceptionally dedicated team propelling world-class innovations!