Mechatronics Engineer (Semiconductor Equipment)

Adecco Personnel Pte Ltd.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading equipment manufacturer for semiconductors seeks a Systems Engineer to support the Mechatronics Department in developing hardware and software for Die Bonder equipment. Responsibilities include defining hardware/software requirements, optimizing processes, and supporting both internal and external customers. Ideal candidates will have a technical university background, experience in semiconductor engineering, and practical lab skills. This role offers broader responsibilities, including customer project support and travel opportunities.

Qualifications

• University degree in microsystem technology, mechanical, electrical or mechatronic.
• Experience in semiconductor or mechanical/electrical engineering is beneficial.
• Hands-on experience with measurement equipment.

Responsibilities

• Define hardware and software requirements for interdisciplinary teams.
• Conduct experiments to identify suitable system parameters.
• Optimize the Die Bonder system for accuracy and stability.
• Develop 'Die Bonding' process technologies based on customer needs.
• Support internal and external customers with occasional travel.
• Assist product management on customer projects.
• Support manufacturing engineering with assembly and supplier issues.
• Document and present new results.

Skills

Technical education in microsystem technology

Experience in semiconductor or mechanical/electrical engineering

Practical lab work skills

Education

University degree in relevant fields

Job description

The Opportunity:

Adecco is partnering with a Semiconductor Backend Equipment Manufacturer searching for a Systems Engineer. This position will report under Mechatronics Department and participate in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry.

The Job:

• Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
• Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
• Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
• Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)
• Support internal and external customers (occasional business travel)
• Support product management on customer projects
• Support manufacturing engineering on assembly and supplier issues
• Interpretation, documentation and presentation of new results

The Talent:

• Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.
• Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous
• Flair for practical work in the lab and with experience with measurement equipment

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to [e-mail] in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Loo Hui Yang
Direct Line: 9342 5045
EA License No: 91C2918
Personnel Registration Number: R11011456