Lead Research Engineer, Bonding Process Control

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading research organization in Singapore is seeking a Bonding Process Control Engineer to optimize and sustain wafer-level bonding processes. The role involves owning SPC control strategies and driving yield improvement through data analytics. The ideal candidate should have a Bachelor's degree in relevant fields and over 3 years of experience in wafer bonding and advanced packaging. Candidates will collaborate closely with cross-functional teams to improve process stability and efficiency.

Qualifications

• 3+ years of hands-on experience in wafer bonding, advanced packaging or semiconductor process engineering.
• Familiarity with bonding-related metrology including IR inspection and bond-strength measurement.
• Strong command of SPC and statistical data analysis.

Responsibilities

• Own and maintain SPC control strategies for bonding processes.
• Drive yield enhancement through structured data analytics and root-cause investigations.
• Collaborate with process integration and R&D to achieve product ramps.

Skills

SPC

Statistical data analysis

Process control methodology

Problem-solving frameworks (8D, FMEA)

Education

Bachelor's degree in Materials Science, Chemical, Mechanical, Electrical Engineering

Tools

Hybrid wafer bonding equipment

Temporary Bonding & Debonding (TBDB) equipment

Job description

Bonding Process Control Engineer – Role Summary

We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer‑level bonding processes—including hybrid wafer‑to‑wafer bonding, chip‑to‑wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.

This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process‑control strategies for both development and small‑volume prototyping. The engineer will play a critical role in enabling next‑generation heterogeneous integration and advanced packaging technologies.

Key Responsibilities

Process Control & SPC Ownership

• Own and maintain SPC control strategies for bonding processes across multiple toolsets.
• Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, warpage, and thickness.
• Establish and optimize control limits, reaction plans, and process windows to ensure process robustness and manufacturability.

Yield Improvement & Defect Reduction

• Drive yield enhancement through structured data analytics, statistical modeling, DOE, and correlation studies.
• Lead root‑cause investigations for issues such as voids, delamination, alignment offsets, particle‑induced defects, and bonding non‑uniformity.
• Implement systematic defect‑reduction strategies and corrective actions.

Tool & Recipe Ownership

• Serve as the process owner for bonding toolsets, including recipe setup, qualification, matching, and continuous improvement.
• Execute tool health monitoring, run‑to‑run control, and equipment baseline management.
• Collaborate with equipment engineering to enable uptime, stability, and PM efficiency.

Cross‑Functional Collaboration

• Work closely with process integration, R&D, equipment engineering, manufacturing, and quality teams to achieve product ramps, technology transfers, and new capability development.
• Support development builds, engineering lots, and technology bring‑up activities.

Troubleshooting & Advanced Analytics

• Diagnose complex process failures involving void formation, debonding, overlay/registration errors, thermal mismatch, and stress‑related defects.
• Apply AI‑assisted analytics (where available) and multivariate methods to accelerate fault isolation and process optimization.

Documentation & Governance

• Develop and maintain comprehensive documentation:

1. SOPs
2. Control Plans
3. OCAPs (Out‑of‑Control Action Plans)
4. Process Qualification Packages

• Ensure compliance with internal quality systems and customer requirements.

Job Requirements

• Bachelor's degree in Materials Science, Chemical, Mechanical, Electrical Engineering, or related fields.
• 3+ years of hands‑on experience in wafer bonding, advanced packaging, 3D integration, or related semiconductor process engineering.

Process & Tool Expertise

• Practical experience with hybrid wafer bonding, direct bonding, and/or Temporary Bonding & Debonding (TBDB) equipment.
• Familiarity with bonding‑related metrology such as IR inspection, SAM, profilometry, bond‑strength measurement, overlay/alignment metrology, and thickness mapping.

Data & Statistical Skills

• Strong command of SPC, process control methodology, statistical data analysis, DOE, and problem‑solving frameworks (e.g., 8D, FMEA).
• Experience in high‑volume manufacturing or advanced packaging R&D environments is a strong plus.

Industry Knowledge

• Understanding of 3DIC, chiplets, hybrid bonding, and advanced packaging process flows.
• Experience with HVM tools, bonding chemistry, plasma activation, surface conditioning, and thermal/mechanical behavior of bonded wafer stacks isadvantageous.