Laser-Assisted Bonder (LAB) Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading HR advisory firm in Singapore is looking for a LAB Process Engineer to develop and optimize laser bonding processes for advanced packaging applications. The role requires a Bachelor’s degree in Materials Science or Engineering and 2–5 years of hands-on experience in semiconductor packaging. Candidates should have a strong background in troubleshooting and statistical analysis, with a preference for those experienced in Laser Assisted bonding technologies. This position is ideal for someone keen on contributing to high-precision projects in a collaborative environment.

Qualifications

• Minimum 2–5 years of experience in equipment design or semiconductor packaging processes.
• Experience with Laser Assisted bonding technologies preferred.
• Familiarity with bonding equipment and analytical tools required.

Responsibilities

• Develop and optimize laser bonding processes for high-precision applications.
• Troubleshoot laser systems and resolve yield issues.
• Collaborate with R&D and production teams for process qualification.

Skills

Troubleshooting

Statistical analysis

Risk analysis

Process optimization

Education

Bachelor’s or Master’s degree in Engineering or Materials Science

Tools

X-ray

Minitab

SPC

Job description

Laser-Assisted Bonder (LAB) process engineer

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed.
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment’s or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
• Familiarity with advanced process control and manufacturing best practices.
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.