Etch Process Engineer - Advanced Packaging

Ambition Singapore; Singapore; On-site; SGD 50,000 - 80,000; Full time

Job summary

A leading company in Singapore is seeking a skilled Process Engineer to develop and optimize advanced packaging etch processes in a 300mm manufacturing environment. The role includes hands-on development, tool qualification, and close collaboration across functions, with a strong emphasis on process robustness and continuous improvement.

Benefits

Referral bonus of SGD1,000 or SGD350 in shopping vouchers

Qualifications

• Hands-on experience in TSV etch, plasma dicing, bonding etch.
• Strong data analysis, problem-solving skills.
• Preferred experience: Master's or PhD in related field.

Responsibilities

• Develop and optimize etch processes for advanced packaging.
• Execute experiments and analyze data to meet performance targets.
• Mentor junior engineers and ensure EHS compliance.

Skills

Data analysis

Problem-solving

Cross-functional collaboration

Communication

Education

Bachelor's in Engineering, Physics, or relevant field

Master's or PhD in related field

Tools

DOE

SPC

Lean/Six Sigma

Job description

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV, plasma dicing, bonding) in a 300mm manufacturing environment. The role involves hands-on process development, tool qualification, and close collaboration across functions.

Key Responsibilities

Develop and optimize etch processes for advanced packaging (TSV, plasma dicing, bonding)

Execute experiments, analyze data, and meet performance/yield/cost targets

Tool setup, qualification, matching, and troubleshooting

Drive process robustness using DOE, SPC, and Lean/Six Sigma tools

Work with equipment and integration teams on productivity and quality improvements

Support process ownership, reliability testing, and continuous improvement

Mentor junior engineers and ensure EHS compliance

Ideal Requirements

Bachelor's or higher in Engineering, Physics, or relevant field

Hands-on experience in TSV etch, plasma dicing, bonding etch

Strong data analysis, problem-solving, and cross-functional collaboration skills

Preferred: Master's or PhD in related field

Strong communication and interpersonal abilities, especially in cross-cultural settings

If you would like to be considered for this opportunity, please forward a copy of your full CV to [e-mail]

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.sg/refer-a-friend

Etch Process Engineer - Advanced Packaging