Technical Trainer_ Product Specialist - Hybrid Bonding

MANPOWER STAFFING SERVICES (SINGAPORE) PTE LTD; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading staffing agency in Singapore is seeking a technical trainer to conduct hybrid bonding training programs. The ideal candidate will have at least 5 years of experience in a technical environment and a strong background in engineering. Responsibilities include developing training materials, providing technical expertise, and conducting evaluations. The role requires excellent communication skills and the ability to simplify complex subjects for trainees. Competitive compensation is offered.

Qualifications

• Minimum 5 years of experience in a complex technical environment.
• At least 3 years in product support or technical training.
• Hands-on experience with 8k8 Flip chip or die attach processes.

Responsibilities

• Conduct technical training programs for Hybrid Bonder.
• Improve training documents as per customer requests.
• Support technical documentation and publish best-known methods.

Skills

Technical training skills

Communication

Troubleshooting

Technical document writing

Education

Degree/Masters in Mechanical/Electrical/Electronics Engineering

Tools

MS-Office

AutoCad

Job description

Product Know How and Technical development Support

• You will conduct Hybrid bonder technical training programs and help trainee to develop a necessary skills to handle Hybrid bonder
• Improve and develop the standard training document with necessary adjustments escpecially für tailored courses per customer request
• Provides technical subject matter expertise. Ensures consistency of Technical Training Programs within company objectives
• Conduct Hybrid Bonder and process training in house and at customer sites, focusing on specialized / customized courses
• Technical Knowledge and Troubleshooting skills on bonder HW modules, process output responses etc
• Understands the Hybrid bonding process and relate to actual product bonding fingerprints
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM
• Builds-up strong technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
• Able to support post bond analysis like CSAM, OVL measurement etc
• Conducts evaluations, demos and generate test report and instructions

Education

Degree/Masters in Mechanical/Electrical/Electronics Engineering

Work experience

• Minimum 5 years of experience in a complex technical environment and 3 years in Product Support environment or technical training
• Hands on experience in 8k8 Flip chip, Die attach or other product line

Expertise and methodology

• Good PC, MS-Office, AutoCad knowledge
• Possess solid technical aptitude, excellent communicator and able to explain complex subjects in a clear and interesting way.
• Excellent wafer fab Front end/Backend Metrology knowledge