Principal Engineer

Micron; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a CMP Process Development Engineer to enhance product quality for next-gen memory components. The ideal candidate has over 5 years of semiconductor experience and specializes in Chemical Mechanical Planarization (CMP). Responsibilities include optimizing processes, leading projects, and mentoring team members. Excellent communication skills and hands-on experience with CMP equipment are essential. This role offers an opportunity to drive innovation in a collaborative environment.

Qualifications

• 5+ years of experience in semiconductor CMP process development.
• Hands-on experience with CMP equipment and memory technology.
• Excellent communication skills in local and remote settings.

Responsibilities

• Develop and optimize CMP processes for Micron's memory parts.
• Collaborate with vendors on process integration requirements.
• Lead and mentor team members on CMP fundamentals.

Skills

CMP equipment operation

Collaboration and communication skills

Self-driven and adaptable

Technical mentoring

Education

Ph.D. in technical field

Tools

AMAT (LKP)

EBARA-300X

Polishing slurries

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to join Advanced Node team to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Main Responsibilities:

• As a CMP Process Development Engineer, you will be primarily responsible for developing and optimizing CMP processes to improve product quality and reliability for the next generation of Micron's memory parts.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions.
• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes.
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide strategic roadmap for N+, N++ and future NAND Nodes.
• Function in a technical advisory role within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is necessary.

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems,
• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions.
• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings.

Job Requirements/Qualifications

• At least 5 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication
• D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self-driven, adaptable, and able to manage multiple projects.
• Proven ability to take calculated risks and execute novel solutions.
• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

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