Senior Research Engineer (Heterogeneous Integration)

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading research institute in Singapore is seeking a highly motivated Research Engineer to advance next-generation semiconductor packaging processes. You will lead the development of advanced assembly techniques and collaborate with various stakeholders on cutting-edge projects. Ideal candidates hold a Bachelor’s or Master’s degree in a relevant field, with experience in process development or packaging R&D being advantageous. This role offers a unique opportunity to contribute to impactful research in an innovative environment.

Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in process development or packaging R&D is a strong advantage.

Responsibilities

• Lead the design and development of advanced assembly processes for 2.5D/3D packaging.
• Coordinate and execute comprehensive evaluations of processes, equipment, and materials.
• Collaborate with project leaders to align on project requirements.
• Generate detailed engineering reports and contribute to new intellectual properties.
• Engage with stakeholders to understand future demands in semiconductor packaging.

Skills

Process development

Semiconductor packaging

Project collaboration

Education

Bachelor’s or Master’s degree in Materials Science or related field

Job description

About Us

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview

We are seeking a highly motivated Research Engineer to shape and advance next-generation semiconductor packaging processes. This role offers hands‑on involvement in cutting‑edge technologies and the opportunity to contribute to high‑impact projects that push the frontiers of advanced packaging.

Key Responsibilities

• Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan‑Out Wafer‑Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
• Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

Requirements

• Educational Background: Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, Electrical Engineering, or a related field.
• Experience: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage.