Senior Principal Engineer, Systems Engineering (Advanced Packaging)

ASM FRONT-END MANUFACTURING SINGAPORE PTE. LTD.; Singapore; On-site; SGD 100,000 - 140,000; Full time

Job summary

A leading semiconductor technology company in Singapore seeks a Senior Principal Engineer in Systems Engineering for Advanced Packaging. The ideal candidate has a Bachelor's or Master's degree with over 10 years of experience in semiconductor capital equipment. Responsibilities include defining system-level architecture and developing requirements for advanced packaging tools. Applicants should have a deep understanding of vacuum systems and strong analytical skills. This is an opportunity to contribute to cutting-edge technologies in the semiconductor industry.

Qualifications

• Minimum 10 years of experience in semiconductor capital equipment.
• Deep understanding of vacuum systems and contamination control.
• Familiarity with SEMI standards and structured systems engineering.

Responsibilities

• Define system-level architecture for advanced packaging semiconductor tools.
• Develop subsystem requirements for diverse engineering aspects.
• Lead design reviews and ensure engineering deliverables meet performance goals.

Skills

Systems engineering

Analytical skills

Problem-solving

Collaboration

Education

Bachelor’s or Master’s degree in Systems, Mechanical, Electrical or related field

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. Butwe’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a Senior Principal Engineer in Systems Engineering for Advanced Packaging, you’ll define and drive system-level architecture for next-generation semiconductor tools. Your expertise will shape critical subsystems and ensure compliance with global standards, enabling breakthrough performance in advanced packaging. Collaborating across engineering disciplines, you’ll lead innovation that powers the future of semiconductor technology.

What you will be working on

• Define system-level architecture for advanced packaging semiconductor tools (etch, deposition, etc.).
• Develop requirements for subsystems including vacuum and gas delivery, RF power and plasma, motion control and robotics, thermal management, optics/metrology sensors, and safety systems.
• Lead design reviews (SRR, PDR, CDR) and ensure engineering deliverables meet system performance goals.
• Ensure compliance with SEMI standards, CE/UL, and safety requirements.
• Partner with process engineering to align tool performance with wafer results.
• Lead root cause analysis on complex interactions such as plasma–wafer coupling, thermal gradients, mechanical vibration, and contamination.
• Support product roadmap planning and system-level innovation for next-generation equipment.
• Drive FMEA, reliability engineering, risk assessments, and continuous improvement efforts.
• Collaborate with supply chain and manufacturing engineering to ensure design scalability and robustness.

What we are looking for

• Bachelor’s or Master’s degree in Systems, Mechanical, Electrical, or related engineering field.
• Minimum 10 years of experience in semiconductor capital equipment (etch, deposition, metrology, etc.).
• Deep understanding of vacuum systems, contamination control, robotics, plasma physics, motion control, or thermal/fluid systems.
• Familiarity with SEMI standards, DFMEA/FMEA, requirements management tools, and structured system engineering processes.

What sets you apart

• Experience leading cross-functional teams in complex system development.
• Strong analytical and problem-solving skills with a focus on innovation.
• Knowledge of advanced packaging trends and emerging semiconductor technologies.
• Excellent communication and collaboration skills to influence across teams.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting‑edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.