Position Overview
Acts as a technical authority in 3D NAND cell film development, setting strategic direction and leading multi-functional initiatives. Drives department-wide impact by architecting solutions, accelerating innovation adoption, and influencing technical standards. Engages in global projects and mentors engineers to elevate technical excellence.
Key Responsibilities
- Define technical strategy and lead multi-functional projects in cell film development.
- Architect solutions and promote innovative technologies across teams.
- Influence technical standards and drive process improvements.
- Lead advanced process development, fixing, and integration.
- Mentor engineers and foster technical growth.
- Participate in global collaborations aligned with Micron’s engineering expectations.
- Integrate unit processes into full cell packages and validate device/process linkages via wafer-level electricals.
- Drive complex problem solving across process/hardware/device interactions—root cause analysis, FMEA, SPC, and corrective actions that recover window with no yield trade-off.
- Utilize advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance; author correlation models that predict reliability and scaling behavior.
- Lead multi-functional teams and vendor engagements to push hardware/process capability, set achievements, and secure resources.
- Mentor engineers via structured training, case studies, and hands-on development; contribute to Micron’s mentoring programs and help build SME pipelines for Cell Films.
- Publish internal papers, BKMs, and present to senior leadership; uphold Micron’s TLP tenets: Innovate, Focus, Impact, Influence, Lead, Mentor.
Technical Expertise
- Advanced proficiency in thin film processing (ALD, CVD), multi-layer stack design, and device integration.
- Thin-film processing: ALD/CVD nitride/oxide systems, inhibitor chemistries, multi-layer ONO stack design, barrier/protection layers; batch furnace/RTP integration and densification strategies.
- Hands-on experience with cell film hardware and equipment optimization.
- Hardware optimization: Precursor delivery & temperature control, chamber matching/segregation, batch vs single wafer trade-offs, metrology hooks.
- Strong understanding of process-device interactions, reliability modeling, and 3D NAND scaling.
- Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing) and correlating process parameters to device performance.
- Proven ability to lead technical problem-solving and support engineers developing their skills.
Qualifications
- PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related field.
- 15 to 20 years of experience in Thin Film research and development for NAND process specifically Diffusion, CVD, Cell Films.
- Demonstrated leadership in multi-functional development and vendor collaboration.
- Proven track record in architecting solutions, process-device correlation, and mentoring engineers—aligned to Micron’s SMTS leadership expectations.