Senior Manager, Frontend CPIE - HBM & Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

A leading semiconductor company is seeking a Frontend Central Product Integration Engineering Senior Manager in Singapore. The successful candidate will drive yield improvement and quality for High Bandwidth Memory products, ensuring collaboration across global teams. The role demands a minimum of 2 years of experience in Process Integration or Yield Enhancement within wafer fabrication. Offers a chance to lead a team, develop next-generation skills, and travel as necessary. Competitive compensation and growth opportunities await.

Qualifications

• At least 2 years experience in Process Integration, Yield Enhancement, or Process & Equipment Management.
• Experience with High Bandwidth Memory (HBM) products or advanced packaging preferred.
• Willingness to travel as needed for department goals.

Responsibilities

• Provide leadership for HBM product yield, quality improvement, and new product introduction.
• Work with key business partners to develop strategic tools and methodologies.
• Conduct ongoing metrics reviews to ensure achievement of performance goals.

Skills

Leadership

Process Integration

Yield Management

Communication Skills

Training Development

Job description

A leading semiconductor company is seeking a Frontend Central Product Integration Engineering Senior Manager in Singapore. The successful candidate will drive yield improvement and quality for High Bandwidth Memory products, ensuring collaboration across global teams. The role demands a minimum of 2 years of experience in Process Integration or Yield Enhancement within wafer fabrication. Offers a chance to lead a team, develop next-generation skills, and travel as necessary. Competitive compensation and growth opportunities await.