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Senior Engineer, Process Integration, NAND NTI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 70,000 - 100,000

Full time

Yesterday
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Job summary

A leading semiconductor manufacturer in Singapore is seeking a NAND Module Process Integration Engineer to enhance next-generation 3D NAND Product Yield and Quality. The ideal candidate will design, develop and implement innovative process solutions while leading cross-functional teams. Key qualifications include a PhD in relevant fields and skills in data analysis and problem-solving. We foster a collaborative culture emphasizing Micron Values of Innovation, Tenacity, Collaboration, and Customer Focus.

Qualifications

  • Adept at data analysis, problem-solving, and process integration optimization.
  • 2 years of experience in the semiconductor industry is an advantage.
  • Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.

Responsibilities

  • Identify and quantify key module deficiencies and technology gaps.
  • Lead cross-functional teams to address these issues.
  • Assist in the transfer of new technology from R&D to manufacturing.

Skills

Data analysis
Problem-solving
Process integration optimization
Excellent communication

Education

PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering

Tools

JMP
Tableau
Job description

Our vision is to transform how the world uses information to enrich life forall.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life forall.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

  • Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
  • Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
  • Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
  • Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
  • Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
  • Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp‑up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position will have:

Must have:

  • Passionate about semiconductor technology and innovation.
  • Adept at data analysis, problem-solving, and process integration optimization.
  • Excellent communication skills and ability to work in cross-functional teams.

Preferred to have Skills / Experiences as below:

  • PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field
  • 2 years of experience in the semiconductor industry is an advantage.
  • Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable.
  • Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
  • In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
  • Experience in semiconductor R&D product life cycle from design to manufacturing is desirable.
  • Ability to be self‑motivated, and self‑governing with proven ability to work in a demanding & dynamic environment.
  • Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus
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