Senior Engineer Process Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Senior Process Development Engineer to enhance their Advanced Node team. This role involves developing CMP processes, improving product quality, and collaborating with international teams. Candidates should have a PhD in a relevant field and at least 1 year of experience in semiconductor manufacturing, specifically in Chemical Mechanical Planarization (CMP). Strong communication skills and the ability to manage multiple projects are essential. The position offers a dynamic work environment and opportunities for professional growth.

Qualifications

• Minimum 1 year of relevant experience in the semiconductor industry.
• Experience in CMP process development for 300mm wafer fabrication.
• Hands-on experience with CMP equipment.

Responsibilities

• Develop and optimize CMP processes for next-generation memory parts.
• Manage experiments to improve process margins.
• Collaborate with vendors for process integration.

Skills

CMP equipment operation

Deep knowledge of Chemical Mechanical Planarization

Effective communication skills

Collaboration skills

Strong problem-solving abilities

Education

PhD in Materials Science/Chemical Engineering/Electrical Engineering/Mechanical Engineering/Chemistry/Physics

Tools

AMAT (LKP)

EBARA-300X

Optical metrology

Profilometry

Job description

Micron’s NAND Process Development (PD) Singapore group

Micron’s NAND Process Development (PD) Singapore group is looking for Senior Process Development Engineer to join Advanced Node team to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Main Responsibilities

• As a CMP Process Development Engineer, you will be primarily responsible for developing and optimizing CMP processes to improve product quality and reliability for the next generation of Micron's memory parts.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions.
• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes.
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide strategic roadmap for N+, N++ and future NAND Nodes.
• Function in a technical advisory role within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is necessary.

Other Responsibilities

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems.
• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions.
• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings.

Job Requirements/Qualifications

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with minimum 1yr of relevant experience in semiconductor industry with background in Chemical Mechanical Planarization (CMP) in 300mm wafer fabrication.

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology.
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes.

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self-driven, adaptable, and able to manage multiple projects.
• Proven ability to take calculated risks and execute novel solutions.
• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.