Senior Electrochemical Plating Process Engineer

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading research organization in Singapore is looking for a highly experienced Senior Electrochemical Plating Process Engineer to join their advanced packaging team. The successful candidate will have over 10 years of experience in semiconductor manufacturing, specifically in ECP processes. Responsibilities include leading process development, driving yield improvements, and collaborating with cross-functional teams. Preferred qualifications include a Master's degree in relevant fields and strong analytical skills using tools like JMP and Excel. This role offers a chance to contribute significantly to groundbreaking projects.

Qualifications

• 10+ years of experience in semiconductor manufacturing with a focus on ECP processes.
• Proven track record in process development and yield improvement.
• Strong analytical skills with expertise in defect analysis.

Responsibilities

• Lead development and optimization of ECP processes for advanced packaging.
• Drive process control and SPC for BEOL PVD and ECP processes.
• Manage equipment procurement and qualification for plating chemicals.
• Support integration and yield improvement for various builds.
• Conduct DOE and troubleshooting for process enhancement.
• Collaborate with QA and equipment teams for robust performance.
• Champion continuous improvement for cost and productivity.

Skills

ECP process development

Process control

Analytical skills

Education

Master's Degree in Physics, Materials Science, Chemistry, or related field

Tools

JMP

Excel

Job description

About the Role:

We are seeking a highly experienced and driven Senior Electrochemical Plating Process Engineer to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.

Key Responsibilities:

• Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
• Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
• Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
• Support integration and yield improvement for SVP builds such as WLP, FOWLP, and C2W.
• Conduct DOE and troubleshooting for process enhancement and defect reduction.
• Collaborate cross-functionally with QA, integration, and equipment teams to ensure robust process performance.
• Champion continuous improvement initiatives including cost reduction, productivity enhancement, and system optimization.

Job Requirements:

• Master's Degree in Physics, Materials Science, Chemistry, Physics, Material science and equipment or related field.
• Minimum 10 years of experience in semiconductor manufacturing, with strong focus on ECP processes.
• Proven track record in process development, SPC, yield improvement, and equipment qualification.
• Strong analytical skills with tools like JMP, Excel, and defect analysis platforms.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.