R&D Scientist Co-Packaged Optics NSTIC

A*STAR; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading research organization in Singapore is seeking a Ph.D-level engineer to develop optical interconnects for advanced platforms. You will be responsible for modeling optical interconnects, simulating bonding interface impacts, and designing silicon lenses. The ideal candidate should have a deep understanding of optical loss mechanisms and hands-on experience with metrology tools. This is an exciting opportunity to contribute to cutting-edge technology in optical interconnects.

Qualifications

• Ph.D in Engineering or Physics required.
• Strong background in optical interconnect modeling essential.
• Knowledge in wafer-level processes like lithography and plasma etching required.

Responsibilities

• Develop optical interconnects for Co-Packaged Optics platforms.
• Simulate impacts of hybrid bonding interfaces.
• Design lenses for optical I/Os in wafer-scale integration.

Skills

Optical interconnect modeling

Communication skills

Teamwork

Technical reporting

Microscope-based alignment

Education

Ph.D in Engineering or Physics

Tools

Optical testing tools

Metrology tools

Job description

Responsibilities

• Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative-material lenses for optical I/Os in wafer-scale integration.
• Estimate optical losses between grating/edge couplers and fiber interfaces via lens structures.
• Design package level/wafer-level optical interconnects between GPU-GPU and GPU-memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to improve the state of the art in optical interconnects and testing.

Job Requirements

• Ph.D in Engineering or Physics.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
• Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
• Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
• Proficiency with microscope-based alignment, metrology, and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.