Job Search and Career Advice Platform

Enable job alerts via email!

Process Development Engineer (R&D)

Apple

Singapore

On-site

SGD 65,000 - 85,000

Full time

4 days ago
Be an early applicant

Generate a tailored resume in minutes

Land an interview and earn more. Learn more

Job summary

A leading technology company in Singapore seeks a skilled R&D Process Development engineer to advance cutting-edge module technologies. Candidates should possess a degree in engineering and 2-3 years of process R&D experience, especially with module assembly processes like flip chip and lens attachments. You will design manufacturability guidelines, conduct feasibility studies, and report findings to cross-functional teams. Join us to innovate and create revolutionary products in a collaborative environment.

Qualifications

  • Minimum 2 to 3 years of experience in process R&D.
  • Familiarity with various module assembly processes required.
  • Good knowledge of metrology tools and measurement methodologies.

Responsibilities

  • Conduct feasibility studies for new processes.
  • Develop design guidelines for manufacturability.
  • Generate engineering reports based on studies.

Skills

Hands-on experience in module assembly processes
Design of experiments (DOE)
Root cause analysis
Clear communication skills

Education

Degree of Science in Engineering or equivalent

Tools

Metrology tools
Flip Chip bonding equipment
Pick & Place equipment
Job description
Summary

We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation.

Excellent opportunity to join our Process Development team. The successful candidate will have opportunity to conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products?

Description
  • Work on process equipment to conduct proof of concept evaluation and DOEs
  • Establishment of baseline process and metrics
  • Perform process characterization
  • Establish design guidelines for manufacturability
  • Define procedures and metrologies
  • Generate engineering report base on studies and evaluation
  • Reporting of engineering studies to cross-functional team
Minimum Qualifications
  • Degree of Science in Engineering or equivalent
  • Minimum 2 to 3 years of experience in doing process R&D
  • Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding.
Preferred Qualifications
  • Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements, such as lens and VCSEL attach
  • Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
  • Familiarity on different metrology tools and quantitative measurement methodology
  • Clear and effective written and communication skill
  • Resourceful and innovative
  • Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder or any Pick & Place equipment platform OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding), Solder Jetting/Laser Wire Soldering OR 5) SMT (e.g., solder printing, component pick&place, AOI, SPI and reflow)
  • Knowledge on adhesive or epoxy or other bonding material is an advantage
  • Experience in optical components, active alignment and high accuracy bonding process is preferred

Apple is an equal opportunity employer that is committed to inclusion and diversity. Apple provides reasonable accommodations to applicants with disabilities and in accordance with local requirements. Apple is a drug-free workplace.

Get your free, confidential resume review.
or drag and drop a PDF, DOC, DOCX, ODT, or PAGES file up to 5MB.