Package Design Engineer: WLCSP & Wafer-Level PCB Design

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

A leading technology company in Singapore is seeking a Package Design Engineer responsible for product and tooling design. Candidates should have a degree in electrical engineering and experience with wafer-level processes such as BGA and fan-out packaging. The role includes generating electrical layouts, managing design guidelines, and supporting audits. Fresh graduates are welcome to apply and competitive salary is offered.

Qualifications

• Minimum Degree in electrical engineering or similar discipline.
• Good understanding of design guidelines and risk assessment reports.
• Hands-on skills with design software tools.

Responsibilities

• Generate and revise electrical routing layout.
• Prepare design risk assessment reports.
• Manage conversion of internal designs into suppliers’ final design.

Skills

Wafer bumping

WLCSP

BGA packaging

Fan-out packaging

Risk assessment

Design software tools

Education

Degree in electrical engineering or similar discipline

Tools

Cadence APD

Linkcad

CAM350

AutoCAD

GDS

Gerber editors

Job description

A leading technology company in Singapore is seeking a Package Design Engineer responsible for product and tooling design. Candidates should have a degree in electrical engineering and experience with wafer-level processes such as BGA and fan-out packaging. The role includes generating electrical layouts, managing design guidelines, and supporting audits. Fresh graduates are welcome to apply and competitive salary is offered.