Lead Packaging Engineer - 2.5D/3D Metrology & Innovation

Advanced Micro Devices, Inc; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a senior expert to lead the validation and characterization of advanced packaging solutions. The role involves establishing lab capabilities, analyzing data, and guiding junior engineers. The ideal candidate has over 10 years of experience in packaging and is proficient in various characterization methods. This position offers opportunities to collaborate with internal and external partners to advance technology and product roadmaps.

Benefits

Competitive benefits

Collaborative work culture

Qualifications

• 10+ years of experience in packaging and characterization.
• Experience with characterization methods including x-ray imaging and spectroscopy.
• Ability to work independently and as part of a team.

Responsibilities

• Establish packaging lab capabilities for advanced solutions.
• Lead data collection and analysis efforts.
• Drive roadmap enablement aligned to technology and product strategies.

Skills

Packaging and metrology expertise

Data collection and analysis

Statistical methods

Team collaboration

Team collaboration

Education

PhD in mechanical engineering, electrical engineering, material science, or related field

Tools

Optical/electron microscopy

Thermal-mechanical testing equipment

Thermal-mechanical testers

Statistical analysis software

Job description

A leading semiconductor company in Singapore is seeking a senior expert to lead the validation and characterization of advanced packaging solutions. The role involves establishing lab capabilities, analyzing data, and guiding junior engineers. The ideal candidate has over 10 years of experience in packaging and is proficient in various characterization methods. This position offers opportunities to collaborate with internal and external partners to advance technology and product roadmaps.