Principal Engineer Advanced NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Staff/Principal Engineer to drive innovative dry etch technology development. Candidates should have a strong background in R&D, with 3-10 years of experience in dry etch processes, knowledge of plasma physics, and a relevant master's or bachelor's degree. Strong leadership and cross-functional collaboration skills are essential. The position involves developing new processes and leading project teams to ensure successful implementation. Competitive compensation and benefits offered.

Qualifications

• 3-10 years’ experience in dry etch process development in R&D transferring to manufacturing.
• 2-3 years relevant NAND, DRAM or Logic module development experience.
• Demonstrated leadership in problem solving and managing technical projects.

Responsibilities

• Lead Dry Etch unit process and critical module development.
• Collaborate and lead cross-functional teams to solve complex problems.
• Present process technology roadmaps for current and future technology.

Skills

Research and development aptitude

Dry etch process development

Cross-functional teamwork

Plasma physics knowledge

Project management

Statistical process control

Strong computer skills

Education

Master's or PhD in relevant engineering or science fields

Bachelor's in relevant engineering or science fields

Tools

MS Office

SAS software like JMP

Job description

As a Staff/Principal Engineer, you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on state of the art and best in class dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Leading Dry Etch unit process and critical module development

• Develop/innovate dry etch processes to meet structural and electrical specifications
• Collaborate and lead cross functional teams to solve complex structural problems
• Present process and technology roadmaps for current and future technology nodes
• Associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase

Interaction with other Process Areas

• Identify opportunities & drive towards a collaborative solution
• Guide other areas technology roadmaps
• Lead or be a part of cross functional task force groups driving towards a target
• Develop basic knowledge tending to expertise in other areas process hardware, or technologies

Interaction with Dry Etch peers

• Be a resource and mentor for peers in dry etch technology and/or project management
• Provide critical updates to upper management on project status and impacts

Successful candidates for this position will have:

• Demonstrated aptitude for a research and development environment
• 3-10 years’ experience in dry etch process development in R&D transferring to manufacturing
• 2-3 years of relevant NAND, DRAM or Logic module development experience, e.g.: cross-functional teams projects and deliveries
• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
• Demonstrated leadership in problem solving. Experience in managing technical projects
• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
• Expertise in statistical process control and analysis
• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
• Demonstrated ability to lead supplier head to heads
• Data science basics / Python coding / AI coders shall be preferred over candidates without this experience
• Strong computer skills, including MS Office, and SAS software like JmP and similar

Education

• Masters / PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 4-10 years of relevant dry etch process development experience
• Bachelors (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 7-12 years of relevant experience