DMTS - Package Health, APTD

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 100,000 - 150,000; Full time

Job summary

A global technology company in Singapore seeks a DMTS - Package Health to develop and implement package health monitoring solutions. You will lead multi-disciplinary projects, mentor team members, and promote tech innovations. The ideal candidate has over 10 years of semiconductor experience and strong leadership skills. Proficiency in simulation tools is essential. This role offers exciting opportunities to impact high-performance memory products and participate in collaborative technology events.

Qualifications

• 10+ years of experience in semiconductor packaging, testing, or reliability engineering.
• 3+ years of experience as a DMTS in semiconducting.
• Hands-on experience in semiconductor packaging processes.

Responsibilities

• Lead complex, multi-disciplinary projects aligned with strategic goals.
• Promote innovation and champion transformative changes.
• Mentor technical team members and contribute to their growth.

Skills

Semiconductor packaging experience

Technical leadership

Data analytics

Problem-solving skills

Stakeholder management

Education

B.S/M.S./Ph.D. in a relevant field

Tools

Simulation tools

Data analytics platforms

Job description

Micron’s vision is to transform how the world uses information to enrich lifefor all.Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

Job Summary

The DMTS - Package Health will focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions.

Key Responsibilities

• Defines, leads, and drives complex, multi-disciplinary or domain-specific projects that are of critical importance to the organization. Demonstrates strong ownership and multi-functional collaboration to deliver impactful outcomes aligned with Micron’s strategic goals
• Promotes innovation and champions transformative changes that provide Micron with a sustained technical advantage over competitors. Has delivered multiple key innovations that have been efficiently implemented and widely adopted in products.
• Serves as a recognized technical spokesperson within the organization, providing expert-level analysis and mentorship to team members and management on project, technical, and innovation-related matters. Acts as the focal point and acknowledged authority in their area of expertise.
• Actively develops and mentors others, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning and excellence.
• Participates actively in internal technology events such as conferences, workshops, and forums, sharing knowledge and driving collaboration across teams.
• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

Qualifications

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
• 10+ years of experience in semiconductor packaging, testing, or reliability engineering, preferably with complex products.
• 3+ years of experience as a DMTS (Distinguished/Distinguished Member of Technical Staff) in semiconducting.
• Hands-on experience in semiconductor packaging processes or material properties.
• Strong understanding of DRAM or ASIC product testing, test architecture design, and common packaging failure modes
• Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
• Demonstrated experience in leading technical teams and managing cross-functional projects effectively.

Additional/Preferred Qualifications

• Familiarity with AI/ML applications in manufacturing or reliability.
• Experience with package characterization (mechanical, thermal, electrical) techniques and standards.
• Proven problem-solving and multitasking skills.
• Strong communication and stakeholder management skills.