Director(Engineering)

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 120,000 - 150,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an experienced engineering manager to oversee manufacturing processes and drive continuous improvement initiatives. The ideal candidate should have at least 15 years of engineering experience in wafer fabrication, including 5 years in management. Responsibilities include understanding customer needs, leading engineering teams, and setting up performance KPIs.

Qualifications

• Minimum of 15 years engineering experience in wafer fab or wafer bumping house.
• At least 5 years management experience at Director/Deputy Director level.

Responsibilities

• Understand customer requirements and meet/exceed customer goals.
• Drive team to set up stable manufacturing processes.
• Arrange training for Process Managers and Engineers.

Skills

Customer requirement understanding

Statistical Process Engineering

Continuous improvement

Education

Degree in Engineering or Chemistry

Job description

Responsibilities

• Understand customer requirements and meet/exceed customer goals
• Drive team to set up stable manufacturing processes with CpK >1.67
• Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield and quality improvement
• Arrange training for Process Managers and Engineers.
• Deploy FDC and SPC on key equipment
• Partnership with cross functional teams to meet production schedules, quality and safety
• Customer engineering and issues resolution
• Plan and direct all aspects of engineering activities
• Drive team for continuous improvement in cost, yield and quality
• Responsible for setting up department KPIs

Qualifications

• Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level in a fast moving environment
• Thorough knowledge of wafer level packaging, engineering and production