Associate Equipment Engineer / Equipment Engineer (Backend)

SSCK PTE. LTD.; Singapore; On-site; SGD 40,000 - 60,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a skilled individual for a role involving equipment repair and production support. The position requires a Diploma in Mechanical Engineering and a minimum of 2 years of relevant experience in wafer bumping. Successful candidates will need to work on a 12-hour rotating shift and possess strong problem-solving skills. Additional experience in backend assembly is preferred.

Qualifications

• Minimum 2 years of relevant experience in wafer bumping for backend operations.
• Ability to work on 12 hours rotating shift if required.
• Experience in backend assembly process is preferred.

Responsibilities

• Perform line sustaining job function on set-up, conversion and equipment repair.
• Identify problems and develop methods for yield and quality improvements.
• In-charge of various testing processes and preventive maintenance.

Skills

Innovative problem-solving

Communication with engineers

Preventive Maintenance

Mechanical design improvement

Education

Diploma in Mechanical Engineering

Job description

Key Job Accountabilities (Actual daily deliverables):

• Perform line sustaining job function on set‑up, conversion and equipment repair to support production loading.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
• Communicate with Engineers and external vendors to resolve problems.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
• In‑charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.
• Experience in backend assembly process is preferred.
• Perform Preventive Maintenance for all Backend Operation Tools.

Required Experience and Qualifications:

• Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years of relevant experience in wafer bumping for backend operations.
• Ability to work on 12 hours rotating shift if required.
• Had keen to share improvement equipment knowledge and further improve on machine design improvement through machine modification.