Associate Engineer Process Development

UTAC HEADQUARTERS PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading semiconductor assembly company in Singapore is seeking a dedicated professional to lead the setup and buy-off of new processes and machines. The ideal candidate has a minimum Diploma in relevant disciplines and over three years of experience in high-volume electronics manufacturing, preferably in semiconductor assembly. Familiarity with various processes such as SMT and Flip Chip is essential. This role requires a hands-on approach to troubleshooting and data analysis to support engineering activities.

Qualifications

• Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline.
• Experience in high volume electronics manufacturing environment preferably semiconductor assembly.
• Proven experience in assembly FOL/EOL process (at least 3 years' experience).

Responsibilities

• Lead the setup and buy-off of new processes and machines.
• Trouble shoot and resolve machine-related issues to ensure smooth operations.
• Perform data collection, analysis and consolidation to support engineering activities.

Skills

Process setup

Data analysis

Troubleshooting

Familiarity with SMT/Flux Clean

Familiarity with Flip Chip/TCB

Familiarity with Underfill

Familiarity with Lid Attach/Laser Mark

Familiarity with Ball Mount/AOI

Education

Diploma in Material Science

Diploma in Applied Physics

Diploma in Mechanical Engineering

Tools

JMP data analysis software

Job description

Job Description

This role is fully hands-on and includes, but no limited to the following responsibilities:

• Lead the setup and buy-off of new processes and machines.
• Perform process setup, buy-off and execution of characterization activities, including DOE, prototype, qualification and mass production build.
• Trouble shoot and resolve machine-related issues to ensure smooth operations problem.
• Perform data collection, analysis and consolidation to support engineering activities.

Requirement

• Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline.
• Experience in high volume electronics manufacturing environment preferably semiconductor assembly.
• Must be familiar and have hands-on experience with either one of the following process and machines, (i) SMT/ Flux Clean, (ii) Flip Chip/ TCB, (iii) Underfill, (iv) Lid Attach/ Laser Mark, (v) Ball Mount/ AOI.
• Familiar with JMP data analysis capability.
• Knowledge and experience on multiple process of the above will be an advantage.
• Proven experience in assembly FOL/ EOL process (at least 3 years' experience).