Advanced Packaging Engineer

Advanced Micro Devices, Inc; Singapore; On-site; SGD 100,000 - 140,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a highly collaborative leader to drive the experimental validation and characterization of advanced packaging solutions. The ideal candidate will have over 10 years of experience in semiconductor packaging and a strong technical background. Responsibilities include establishing lab capabilities, leading data collection, and cultivating strategic partnerships. An advanced degree in relevant engineering fields is preferred. Join this dynamic environment to advance your career significantly.

Benefits

AMD benefits at a glance

Qualifications

• 10+ years of experience in packaging, metrology, characterization, design validation.
• Experienced with data collection and statistical methods.
• Proven ability to work both independently and collaboratively.

Responsibilities

• Establish packaging lab capabilities and characterization processes.
• Lead data collection and collaborate with internal and external partners.
• Drive technology and product roadmap enablement.

Skills

Collaboration

Technical leadership

Data collection and analysis

Characterization techniques

Education

Advanced degree in mechanical engineering, electrical engineering, material science, physics or equivalent

Tools

Optical/electron microscopy

Thermal-mechanical testing

Statistical methods

Chromatography

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

THE ROLE

Lead experimental validation and characterization of advanced packaging solutions such as 2.5D / 3D, CPO, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities.

THE PERSON

The ideal candidate is a highly collaborative leader with strong technical background in semiconductor packaging, metrology, and characterization who will ensure alignment with technology and product roadmaps.

KEY RESPONSIBILITIES

• Establish Packaging Lab Capabilities: drive experimental validation and characterization of advanced packaging solutions such as 2.5D / EFB / CoWoS / WLFO, CPO, CoW / WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies.
• Lead Data Collection & Analysis: collaborate with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities).
• Drive Technology & Product Roadmap Enablement: define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps.
• Cultivate Strategic Partnerships: develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners.
• Provide Technical Leadership: offer expert guidance on metrology and package characterization techniques, stay abreast of industry trends and advancements, mentor and guide junior engineers and technicians.

PREFERRED EXPERIENCES

• 10+ years of experience in packaging, metrology, characterization, design validation of components, packages and platforms.
• Experience with a variety of characterization methods including optical/electron microscopy, thermal‑mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moiré, x‑ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC‑MS).
• Experience with data collection and analysis, including statistical methods.
• Demonstrated ability to work independently and in a team environment.

ACADEMIC CREDENTIALS

Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent.

LOCATION

Singapore (#LI-CK1)

BENEFITS

Benefits offered are described: AMD benefits at a glance.

EEO STATEMENT

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and / or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.