3065307 Senior Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

Qualcomm; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A global technology company in Singapore is looking for a senior Hardware Engineer to lead the development of innovative RF Front End Modules. This role requires extensive experience in electronics packaging and a solid background in engineering. The ideal candidate will have over 10 years of relevant experience and excellent communication skills. The position involves interdisciplinary collaboration and international travel.

Qualifications

• 10+ years of experience in electronics packaging.
• 5+ years of experience in process engineering or quality management.
• Strong understanding of semiconductor packaging materials.

Responsibilities

• Lead technology integration and risk assessment.
• Support new technology development for RF-SiP applications.
• Interface with foundries for critical project management.

Skills

Electronics packaging

RF module industry

Process engineering

Communication skills

Education

Master’s Degree in Mechanical/Materials/Chemical Engineering

Tools

PCB design and layout tools

Job description

Company:

Qualcomm Asia Pacific Pte. Ltd.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

Overview

Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams. Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end or back-end processes, and supplier interactions.

Responsibilities

• Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
• Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging (CPI).
• Monitor and improve existing processes to improve yield, quality, and throughput, thereby increasing efficiency and product reliability. Support new pioneering singulation development.
• Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies to anticipate and address potential integration challenges.
• In-depth knowledge of Backend-of-the-Line (BEOL) processes, with an additional benefit on experience in photolithography techniques.
• Conversant with substrate and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications.
• Formulate industry-leading design guidelines which involves a comprehensive approach that incorporates lessons from past failures and acknowledges manufacturing constraints.
• Create, conduct, and analyze Design of Experiments (DOE) for development activities, especially those that relate to bump/die sort quality, yield and impact on CPI.
• Support development of advanced technologies for RF-SiP applications.
• Lead all aspects technology integration into PAMIDs, perform technical risk assessment, launch mitigation plans and ensure yield and reliability metrics are met and are in line with PAMID release schedules.
• Understand substrate and assembly Packaging process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs and Quality metrics. Conduct audits, benchmarking and drive best practice methodologies to proactively prevent quality excursions as the technology ramps.
• Interface with foundries and OSATs for direct project management of critical programs.
• Resolve quality, yield and manufacturing problems with structured methods of problem solving.
• Lead all aspects technology integration into products, perform technical risk assessment, launch mitigation plans and ensure yield and reliability metrics are met and are in line with product release schedules.
• Team cross-functionally with Design, Device process development, Packaging, FEA and global NPI teams to support technology readiness for new products.
• Ideate, Sketch and Participate in value engineering and cost reduction plans along with Qualcomm Packaging and Sourcing teams.
• Ensure product readiness for ramp. Protect product integrity post ramp.

Qualifications

• Master’s Degree or equivalent in Mechanical / Materials / Chemical Engineering. PhD preferred.
• 10+ years of experience in electronics packaging in related environments, especially RF module industry.
• At least 5 years direct experience in process engineering, product integration or quality management at tier 1 foundries, or assembly sub-contractors.
• Solid technical understanding of full range of semiconductor packaging materials, material interactions, processes, dominant failure mechanisms and analytical techniques.
• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
• Understanding of package/product qualification and reliability methods and failure analysis is required.
• Familiarity with PCB design and layout tools preferred.
• Understanding of statistics, control methodology, FMEA, analytical trouble shooting in a factory environment is required.
• Excellent communication skills.
• Willingness to travel internationally, typically once per quarter.

Minimum Qualifications

• Bachelor\'s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
OR
Master\'s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

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