Team Lead - Films Technology

Plessey Semiconductors Ltd; Roborough; On-site; GBP 65,000 - 85,000; Full time

Job summary

A leading semiconductor manufacturing company in the UK is seeking a Team Lead for Films Technology to oversee technology development for advanced MicroLED display devices. The ideal candidate will have over 7 years of experience in thin-film engineering and a background in leading technical teams. Responsibilities include innovating processes, ensuring deposition quality, and managing team performance. This role is crucial for enhancing device efficiency and reliability in a fast-paced environment.

Qualifications

• Significant industry experience (7+ years) in thin-film engineering within the semiconductor industry.
• Proven experience leading engineers, projects, or technical teams.
• Ability to prioritise and deliver within tight development cycles.

Responsibilities

• Drive process innovation to enhance device efficiency, reliability, and surface quality.
• Take ownership of deposition process modules and ensure high-quality film performance.
• Lead continuous improvement initiatives to reduce downtime and troubleshoot complex issues.

Skills

Thin-film engineering

Process innovation

Cross-functional collaboration

Problem-solving

Education

Master’s or PhD in Materials Science, Electrical Engineering, or Applied Physics

Tools

PVD

ALD

PECVD

SEM

TEM

Job description

About This Role

We are seeking an experienced and innovative Team Lead for Films Technology to drive the development, optimisation, and integration of thin‑film processes for advanced MicroLED display devices. This role oversees end‑to‑end technology development, including epitaxial layers, passivation films, optical coatings, buffer layers, and functional thin films critical to MicroLED performance, yield, and reliability. The ideal candidate has strong technical depth in semiconductor materials and thin‑film engineering, along with proven leadership experience in guiding cross‑functional teams. Master’s or PhD in Materials Science, Electrical Engineering, Applied Physics, or a related discipline.

Key Responsibilities

• Drive process innovation to enhance device efficiency, reliability, uniformity, and surface quality.
• Take ownership of deposition process modules (PVD, ALD, PECVD, sputtering, evaporation, plating) and ensure stable, high‑quality film performance.
• Work closely with epitaxy, device, and integration teams to define film requirements and deliver optimised stack architectures.
• Establish and refine process windows through DOE, SPC, and data‑led analysis.
• Identify and resolve thin‑film defect mechanisms such as particles, stress, adhesion, moisture ingress, and interface issues.
• Support reliability engineering by assessing film stability under thermal, optical, electrical, and environmental stress.
• Utilise advanced metrology (SEM, TEM, AFM, ellipsometry, XRR, XPS, SIMS, etc.) to ensure film quality and process control.
• Act as Tool Owner for assigned equipment, maintaining tool performance, uptime, safety, and accurate documentation.
• Lead continuous improvement initiatives to reduce downtime, enhance tool capability, and troubleshoot complex tool or process issues.
• Provide day‑to‑day leadership to the module team, including line management of Apprentices, Graduates, Engineers, and Senior Engineers.
• Conduct performance reviews, set objectives, and support the technical and professional development of team members.
• Oversee resource planning to ensure effective deployment of personnel, equipment, and expertise across projects.
• Collaborate with the Module Manager to align team activities with broader project and company objectives.

Qualifications

• Significant industry experience (7+ years) in thin‑film engineering within the semiconductor industry.
• Practical expertise in thin‑film deposition (PVD, ALD, PECVD, MOCVD, sputtering, evaporation).
• Strong background in microfabrication and device process integration.
• Proven experience leading engineers, projects, or technical teams.
• Demonstrated tool ownership.
• Strong technical judgement and decision‑making skills.
• Effective cross‑functional communication and collaboration.
• Excellent problem‑solving skills, particularly in ambiguous or fast‑moving environments.
• Ability to prioritise and deliver within tight development cycles.
• Strategic thinker with the ability to plan roadmaps and guide technology direction.

Advantage

• Experience with GaN‑based device processing and characterisation.
• Good understanding of MicroLED device architecture, materials challenges, and reliability mechanisms.
• Previous line management experience.
• Knowledge of optical coatings and light‑management films used in display devices.
• Familiarity with high‑volume manufacturing (HVM) processes and scaling challenges.
• Experience in defect engineering, surface passivation, or interfacial film optimisation.