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Huawei Research Center Germany & Austria

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53981197d4cd

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27.04.2025

11.06.2025

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Huawei's vision is to enrich life through communication. We are a fast-growing and leading global information and communications technology (ICT) solutions provider.

Driven by a commitment to operations, ongoing innovation, and open collaboration, we have established a competitive ICT portfolio of end-to-end solutions in Telecom and enterprise networks, Devices, and Cloud technology and services.

Huawei is active in more than 170 countries and has over 197,000 employees, of which more than 80,000 are engaged in research and development (R&D). Join us to work in a dynamic, multinational environment with more than 150 nationalities worldwide.

Huawei's Munich Research Center focuses on advanced technology research, architectural development, design, and strategic engineering of our products.

We are looking for a senior engineer specializing in chiplet multi-physics simulation. Thermal, interconnection, and stress issues are crucial in developing highly integrated systems. Join our team to explore advanced packaging methods.

Your mission

• Develop and analyze multiphysics simulation models focusing on chip thermal dissipation, die-to-die communication, and thermal stress analysis.
• Review top-tier conference articles on heat simulation methodologies and heat dissipation solutions in academia and industry.
• Provide insight reports on the latest developments in semiconductor technologies, especially in heat dissipation, interconnection, and thermal stress.
• Establish connections with academic organizations (e.g., IEEE, ESIA) and collaborate with core members and experts.
• Organize internal seminars and workshops, maintaining regular technical exchanges with academic and industry partners.

Your areas of expertise

• Ph.D. in microelectronics, nanotechnologies, physics of semiconductors, or related fields.
• Strong knowledge in semiconductors, innovative materials, nano-/micro-fabrication processes (FEOL, BEOL), heterogeneous integration, 3DIC packaging, optoelectronic components, and device thermal management.
• Analytical skills, insight, and self-learning capabilities.
• Willingness to travel within Germany and Europe for conferences and seminars.
• Fluency in English; German or Chinese language skills are a plus but not required.

By applying, you agree to our recruitment privacy statement.

Your rewards working here

• Innovative culture emphasizing teamwork and knowledge exchange within our global network.
• Healthy meals in our renowned canteen.
• Comprehensive training programs, including language courses in German and Mandarin.
• Inclusive environment with diverse nationalities.
• Self-responsible work in a motivated and growing team.

Please submit your application and CV (including cover letter and references) in English.

Huawei is a leading global ICT solutions provider, committed to developing the future information society and building a better connected world.