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A leading design service provider in Dresden is seeking an IC-Package Design Engineer to develop and simulate advanced packaging solutions for integrated circuits. The role involves close collaboration with chip design teams and requires strong knowledge of PCB and substrate design. Ideal candidates possess a Bachelor’s/Master’s degree in Electrical Engineering or equivalent, with skills in automation scripting and a team-oriented approach. The positions offer flexible working hours and additional benefits.
Your Task is to design and simulate state of the art Flip-Chip-, Wirebond-, and Chip-Scale-Packages for integrated circuits. To design the optimal IC-Package you will work in close cooperation to our chip design teams.
Knowledge in any of these tools would be a plus:
Location: Dresden, Germany
Employment Type: Full-time (up to 40 hours per week)
Racyics® is Europe’s leading design service provider for mixed-signal system-on-chip design and turnkey ASIC services in advanced nodes.
We deliver professional analog, digital and mixed-signal design services tailored to the customers’ needs with focus on realization of complex System-on-Chips in leading edge technology nodes. Our team of more than 150 employees covers the complete chip design process up to system architecture development. Racyics is working for major German and international semi-custom companies both as a service provider and in collaborative partnerships.
Working at Racyics comes with many benefits, including flexible working hours, mobile work, a financial contribution to your childcare costs and great team events.