Design Team Lead

Delve Search - Global Search Consultants; München; Vor Ort; EUR 80.000 - 100.000; Vollzeit

Zusammenfassung

A leading global semiconductor company seeks a Custom Design Team Lead in Munich, Germany. This role involves leading a team in developing advanced embedded non-volatile memory (NVM) IP for next-generation technologies. Candidates should possess a Master’s degree in Electrical Engineering and extensive experience in custom circuit design, particularly with NVM technologies. Responsibilities include defining specifications, leading design efforts, and collaborating with R&D teams. Attractive compensation and relocation assistance offered.

Leistungen

Attractive compensation

Relocation assistance

Long-term growth prospects

Qualifikationen

• 10+ years’ experience in custom circuit design, ideally with non-volatile memory.
• 5+ years in a technical leadership role with mentoring success.
• Strong experience with modern EDA design flows.

Aufgaben

• Lead a team developing embedded NVM test chips and IP.
• Define design specifications, workflows, and verification methodologies.
• Review critical memory paths and layouts.

Kenntnisse

Custom circuit design

Technical leadership

Collaboration

Design verification

Innovation

Ausbildung

Master’s degree in Electrical Engineering

Tools

Cadence Virtuoso

Jobbeschreibung

Lead the Future of Memory. Shape the Next Wave of Chip Design. Drive Breakthrough Silicon Innovation.

Are you a seasoned custom design engineer ready to take the lead at the cutting edge of semiconductor development? Do you thrive where advanced nodes meet embedded memory — and want to help define the next era of high-performance, low-power chips?

A leading global semiconductor company is seeking an experienced Custom Design Team Lead to head up a specialist group developing advanced embedded non-volatile memory (NVM) IP for next-generation technologies.

This is a strategic leadership position in a growing European hub, working on the most advanced process nodes and collaborating closely with international R&D and product teams.

What You’ll Be Doing

• Lead a team developing embedded NVM test chips and IP, ensuring world-class circuit design and layout quality.
• Define design specifications, workflows, and verification methodologies for complex custom circuits.
• Review critical memory paths, schematics, and layouts to optimise performance, area, and reliability.
• Analyse silicon data and debug design issues, collaborating across global engineering functions.
• Coordinate technology specifications, characterisation, and reliability processes with cross‑functional teams.
• Support customer integration, ensuring robust performance across automotive, AI, and industrial applications.

What You Bring

• Master’s degree or higher in Electrical Engineering, Microelectronics, or a related field.
• 10+ years’ experience in custom circuit design, ideally with non-volatile memory (Flash, MRAM, RRAM, PCRAM) or similar analog / mixed‑signal technologies.
• 5+ years in a technical leadership role with demonstrated success in mentoring and project delivery.
• Strong experience with Cadence Virtuoso and modern EDA design flows; confident in verification, layout, and silicon validation.
• A proactive, collaborative mindset with a passion for technical excellence and innovation.

Why This Role

• Lead a high‑impact design team working on next‑generation embedded memory.
• Work at the forefront of advanced node technologies and contribute to global R&D programmes.
• Shape the culture and direction of a new European team from the outset.
• Enjoy a technically rich, collaborative environment where innovation is actively encouraged.
• Attractive compensation, relocation assistance, and long‑term growth prospects in a world‑leading semiconductor ecosystem.

This is a rare opportunity to combine deep technical leadership with hands‑on design impact — bringing next‑generation memory from concept to silicon.

If you’re driven by challenge, collaboration, and innovation, we’d love to hear from you.