Package Design Engineer

Tenstorrent; Toronto; Hybrid; CAD 136,000 - 685,000; Full time

Job summary

A leading AI technology company is seeking a Package Design Engineer in Toronto. The ideal candidate has hands-on experience with 2.5D/3D chiplet packaging and a BS/MS in Mechanical/Electrical Engineering. Responsibilities include optimizing design methodologies and collaborating with cross-functional teams. Competitive compensation ranges from $100k - $500k depending on experience and qualifications, with a hybrid working model in place. Join a diverse team passionate about AI and innovative solutions.

Benefits

Competitive salary

Comprehensive benefits

Qualifications

• 5+ years experience in layout and routing of 2.5D packages.
• Ability to support layout verification and package sign-off.
• Experience in managing supplier engagement for process improvements.

Responsibilities

• Drive the design of 2.5D/3D chiplet packaging.
• Create and maintain engineering documentation for clear communication.
• Support verification processes and design methodologies optimization.

Skills

Hands-on experience in Organic and Advanced 2.5D/3D chiplet packaging

Ability to optimize routing and design methodologies

Collaboration with cross-functional engineering teams

Proficiency with scripting (Python, TCL, SKILL)

Education

BS/MS in Mechanical/Electrical Engineering

Job description

Overview

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

We are seeking a Package Design Engineer with hands-on experience in Organic and Advanced 2.5D/3D Chiplet packaging. The ideal candidate is proactive, technically curious, and driven to improve design velocity through SIPI-aware methodologies, AI automation, and strong cross-functional collaboration.

This role is hybrid, based out of Toronto, ON or Taipei City, TW.

Who you are

• Seasoned Package Design Engineer with hands-on experience in Organic and Advanced 2.5D/3D chiplet packaging.
• Experience owning placement and routing of Tenstorrent packages, including organic substrates and 2.5D interposers.
• Optimize routing, stack-ups, and design methodologies for emerging package technologies.
• Support layout verification, design rule checking (DRC), and overall package sign-off activities.
• Drive supplier engagement to develop new capabilities and continuous process improvements ahead of program needs.
• Create and maintain engineering documentation, including design rules, design intent, and BOM definition to ensure clear technical communication across teams.

What we need

• BS/MS in Mechanical/Electrical Engineering with 5+ years experience in layout and routing of 2.5D packages (CoWoS-S, -L, -R).
• Previous ownership of FCBGA package verification and tapeout (DRC/LVS, sign-off processes).
• Demonstrated ability to collaborate effectively with cross-functional engineering teams and external suppliers.
• Proficiency with automation and scripting (Python, TCL, SKILL, or similar).

What you will learn

• Depth with Organic and Advanced 2.5D/3D chiplet packaging.
• AI-based approach for fast iteration on different design ideas.
• SIPI-aware methodologies.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country.

Additional information

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.