Microelectronics Process Engineer

Global Talent Alliance, Canada; Ottawa; On-site; CAD 70,000 - 90,000; Full time

Job summary

A leading technology firm in Ottawa seeks a Microelectronics Process Engineer to manage and develop processes for manufacturing advanced RF, optical, and microelectronic components. Candidates must have a university degree in engineering and over 2 years' experience in a Process or Manufacturing Engineering role. Responsibilities include project management, process documentation, and supporting NPI builds. The firm values hands-on experience and knowledge of lean manufacturing principles. Competitive compensation and professional development opportunities are offered.

Qualifications

• Minimum 2 years of experience in a Process or Manufacturing Engineering support role.
• Experience in wafer level processing preferred.
• Experience with equipment programming beneficial.

Responsibilities

• Manage and implement new processes in a manufacturing environment.
• Support new technology research and development.
• Troubleshoot process performance problems and coach team members.

Skills

Process engineering solutions

Wafer level assembly

Optical and microelectronic technologies

Lean manufacturing principles

DFM and FMEA

Education

University degree in Engineering (Mechanical or Photonics preferred)

Tools

AutoCad

SolidWorks

Microsoft Office Suite

Job description

About the job Microelectronics Process Engineer

Job#80236

Job Purpose
The Microelectronics Process Engineer will manage, develop and implement new processes to be used in our manufacturing environment - embracing advanced RF, optical and microelectronic components, modules and sub-systems.

Nature of Duties / Responsibilities

• Work directly with RF, optical and microelectronic product design and development teams to provide process engineering solutions in support of new product development, with subsequent NPI and manufacturing support.
• Wafer level assembly experience would be an asset for this position.
• Supports new technology research and development pertaining to optical and microelectronic process solutions.
• Manages projects and timelines in order to meet milestones and deliverables of various customer projects.
• Application program on high end automated assembly equipment (dispensers, die bonders, wirebonders, optical aligners, etc.).
• Develops processes related to the assembly of Optical and Microelectronic modules, such as:
  • SMT + flip chip assembly (multi chip modules)
  • Flip chip underfill
  • Epoxy dispensing, high accuracy die bonding
  • Semiconductor die and microelectronic components bonding and interconnection (wirebond)
  • Packaging encapsulation
  • Optical active/passive alignment
• Troubleshoots and analyzes process performance problems. Provides technical guidance to less experienced team members.
• Conducts research into complex engineering problems to develop new operating policies, capabilities, and processes.
• Assists the Process Engineering team to deliver on accountabilities. Takes ownership for processes under his/her control.
• Creates process assembly documentation.
• Tooling and fixture design and procurement.
• Performs qualification on new processes being introduced.
• Implements and suggests engineering changes.
• Researches, procures, and accepts new pieces of equipment for continuously evolving technologies.
• Supports customer NPI builds within tight timelines.
• Provides DFx type feedback to the internal design team as well as external customers to help optimize manufacturability of products as well as increase yields and throughput.

Education & Experience

• Requires a University degree in Engineering (Mechanical or Photonics preferred).
• 2+ years' experience in a Process or Manufacturing Engineering support role.
• Experience with Optical and Microelectronic technologies and processes.
• Experience with wafer level processing (wafer level packaging, backend wafer processing) would be preferred.
• Experience with AutoCad/SolidWorks.
• Hands-on build experience would be an asset (handling bare dies or miniature components with tweezers, use of microscopes, camera systems, etc.)
• Experience with equipment programming (auto dispensers, pick and place machines, welders, etc.) would be beneficial.
• Exposure to product design and development phases would be beneficial.
• A background in the execution of "best practice" process control is required.
• Experience with lean manufacturing principles.
• Experience with DFM and FMEA would be an asset.
• Experience with Microsoft Office Suite (Word, Excel, PowerPoint).