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Assistant Mfg Engineer: Wire Bonding & Process Improvement
Job summary
A technology company based in Singapore is seeking a qualified individual for a technical role involving equipment assembly, testing, and maintenance of wire bonder equipment. Candidates must possess a degree in engineering and have at least 3 years of relevant experience in the semiconductor or manufacturing industries. Strong leadership and communication skills are essential, as well as the ability to provide technical support and conduct training.
Qualifications
- Degree/Diploma in Mechanical/Electrical/Electronics Engineering or equivalent.
- Minimum 3 years of experience in Semiconductor or Manufacturing.
- Knowledge of equipment assembly and troubleshooting.
Responsibilities
- Perform setup, assembly, testing and maintenance of wire bonder equipment.
- Provide technical support related to assembly and drawing specifications.
- Conduct training and work with departments to achieve quality output.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.