Job Search and Career Advice Platform

Enable job alerts via email!

System Engineer (TC)

BESI SINGAPORE PTE. LTD.

Singapore

On-site

SGD 60,000 - 80,000

Full time

Yesterday
Be an early applicant

Generate a tailored resume in minutes

Land an interview and earn more. Learn more

Job summary

A leading technology firm in Singapore is seeking a Systems & Process Engineer to develop hardware and software modules for Die Bonder equipment in the semiconductor industry. This role involves optimizing system performance, defining interdisciplinary requirements, and supporting customers on projects. The ideal candidate holds a technical degree and has experience in mechanical or electrical engineering, complemented by strong skills in mathematics and lab work.

Qualifications

  • Technical education in microsystem technology, mechanical, electrical or mechatronic.
  • Experience in semiconductor, mechanical or electrical engineering is advantageous.

Responsibilities

  • Develop hardware and software modules for semiconductor equipment.
  • Define requirements for development teams across disciplines.
  • Optimize Die Bonder system for accuracy, stability, and productivity.
  • Support internal and external customers on projects.

Skills

Mathematics
Mechatronics
Material Science
Practical lab work
Measurement equipment
Written and spoken English
Microsoft Office
Programming knowledge

Education

Technical education at university, ideally in microsystem technology, mechanical, electrical or mechatronic
Job description
Systems & Process Engineering
  • Participate in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).
  • Define hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control).
  • Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences.
  • Optimization of the Die Bonder system with the focus on accuracy, stability and productivity.
  • Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement).
Customer Support
  • Support internal and external customers (occasional business travel).
  • Support product management on customer projects.
  • Support manufacturing engineering on assembly and supplier issues.
Knowledge Management
  • Interpretation, documentation and presentation of new results.
Education

Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.

Experience

Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous.

Expertise
  • Expertise in mathematics, mechatronic or material science.
  • Flair for practical work in the lab and experience with measurement equipment.
  • Good command of written and spoken English.
  • Microsoft office and programming knowledge.
Get your free, confidential resume review.
or drag and drop a PDF, DOC, DOCX, ODT, or PAGES file up to 5MB.