Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A leading technology firm located in Singapore seeks an experienced professional to act as a technical authority in 3D NAND advanced thin film development. This role involves leading multi-functional projects, mentoring engineers, and influencing technical standards. Candidates should have a PhD in a related field with 15 to 20 years of experience in thin film research and development. Strong leadership and problem-solving skills are essential. This position offers an opportunity to drive innovation and technical excellence.

Qualifications

• 15 to 20 years of experience in Thin Film research and development for NAND process.
• Demonstrated leadership in multi-functional development and vendor collaboration.
• Proven track record in architecting solutions and mentoring engineers.

Responsibilities

• Define technical strategy and lead multi-functional projects in development.
• Mentor engineers to foster technical growth.
• Drive complex problem solving across process, structure, and device interactions.

Skills

Thin film processing

Process-device correlation

Leadership

Characterization techniques

Education

PhD in Materials Science or related field

Tools

SIMS

XPS

TEM

Electrical stress testing

Job description

Our vision is to transform how the world uses information to enrich life forall.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn,communicateand advance faster than ever.

Position Overview

Acts as a technical authority in 3D NANDAdvanced thinfilm development, setting strategic direction and leading multi-functional initiatives. Drives department-wide impact by architecting solutions, accelerating innovation adoption, and influencing technical standards. Engages in global projects andmentorsengineers to elevate technical excellence.

Key Responsibilities

• Define technical strategy and lead multi-functional projects instructural and electricfilm development.

• Architect solutions and promote innovative technologies across teams.

• Influence technical standards and drive process improvements.

• Lead advanced process development, fixing, and integration.

• Mentor engineers and foster technical growth.

• Participate in global collaborations aligned with Micron’s engineering expectations.

• Integrate unit processes into fullmodulepackages andvalidatewithin and cross-module interactions,device/process linkages via wafer-level electricals.

• Drive complex problem solving across process/structure/hardware/device interactions—root cause analysis, FMEA, SPC, and corrective actions that recover window with no yield trade-off.

• Utilize advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance;derivecorrelation models that predict reliability and scaling behavior.

• Lead multi-functional teams and vendor engagements to push hardware/process capability, set achievements, and secure resources.

• Mentor engineers via structured training, case studies, and hands-ondevelopment;contribute to Micron’s mentoring programs and help build SME pipelines forAdvanced ThinFilms.

• Publish internal papers, BKMs, and present to senior leadership; uphold Micron’s TLP tenets: Innovate, Focus, Impact, Influence, Lead, Mentor.

Technical Expertise

• Advancedproficiencyin thin film processing (Plasma Enhanced CVD, Thermal CVD,ALD).

• Hands-on experience withstructural andelectricfilm hardware and equipment optimization(dielectric andcarbon basedfilms).

• Hardware optimization: Precursor delivery & temperature control, chamber matching/segregation, batch vs single wafer trade-offs, metrology hooks.

• Strong understanding of process-mechanical-device interactions, reliability modeling, and 3D NAND scaling.

• Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing) and correlating process parameters tostructural anddevice performance.

• Proven ability to lead technical problem-solving and supportengineersdeveloping their skills.

Requirements

PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or relatedfield.

15 to 20 years of experience in Thin Film research and development for NANDprocessspecificallyplasma and thermal CVD for dielectric(includinghighKandlowK)and carbon-based depositions.

Demonstrated leadership in multi-functional development and vendor collaboration.

Proventrack recordin architecting solutions, process-device correlation, and mentoring engineers—aligned to Micron’s SMTS leadership expectations.